LFECP33E-5FN484C

The LFECP33E-5FN484C is a commercial-grade FPGA from Lattice Semiconductor’s LatticeECP/EC family. It pairs a high-density FPGA fabric—32,800 logic elements—with on-chip memory and dedicated DSP capabilities to address mainstream embedded and communications applications.

Packaged in a 484-ball fpBGA (23 × 23 mm) surface-mount package with 360 user I/Os, the device operates from a 1.14 V to 1.26 V supply and is specified for 0 °C to 85 °C operation. The series architecture provides flexible I/O standards, dedicated DDR memory interface support and multiple PLLs for system clocking.

Key Features

• Core Density  32,800 logic elements (LUT-based fabric) for implementing complex logic, state machines and control functions.
• On-chip Memory  Total on-chip RAM: 434,176 bits, with the family offering a mix of embedded block RAM (sysMEM) and distributed memory resources for buffering, FIFOs and scratch storage.
• Dedicated DSP Blocks  Series-level sysDSP blocks provide high-performance multiply-accumulate resources; the LFECP33 family supports up to eight sysDSP blocks for DSP and signal processing tasks.
• Flexible I/O  360 user I/Os in a 484-ball fpBGA; programmable sysI/O buffer supports LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI and multiple differential standards including LVDS, Bus-LVDS, LVPECL and RSDS.
• Memory Interface Support  Dedicated DDR memory interface logic with series-level support for interfaces up to DDR400 (200 MHz) to simplify external memory integration.
• Clocking  Up to four analog PLLs per device for clock multiply/divide and phase shifting to support varied timing domains.
• Package & Mounting  484-FPBGA (23 × 23 mm) surface-mount package (484-BBGA), suitable for compact board designs requiring high I/O counts.
• Power & Temperature  Supply voltage range: 1.14 V to 1.26 V. Operating temperature: 0 °C to 85 °C (commercial grade).
• Compliance  RoHS compliant.

Typical Applications

• Signal Processing and DSP  Use the device’s sysDSP blocks and dense logic fabric for filtering, transforms and real-time signal workloads.
• Memory Interface and Buffering  Leverage dedicated DDR support and on-chip RAM for memory controllers, buffering and data path staging.
• Protocol Bridging and I/O Aggregation  High I/O count and programmable sysI/O support multiple serial and parallel standards for interface conversion and multi-protocol gateways.
• Embedded Compute for Commercial Systems  Implement control logic, hardware acceleration and custom peripherals in communications and industrial embedded equipment.

Unique Advantages

• High logic capacity: 32,800 logic elements enable integration of complex functions that reduce external component count.
• Substantial on-chip memory: 434,176 bits of RAM provide local storage for buffering and intermediate data processing, minimizing external memory traffic.
• Rich I/O flexibility: 360 user I/Os with broad protocol support simplify multi-standard interface designs and reduce level-shifting needs.
• Built-in DSP resources: Multiple sysDSP blocks accelerate arithmetic-intensive tasks without offloading to external processors.
• Dedicated DDR support: On-chip DDR interface logic supports integration with external DDR memories for high-bandwidth applications.
• Compact, high-density package: 484-ball fpBGA in a 23 × 23 mm footprint balances I/O count and board space for compact systems.

Why Choose LFECP33E-5FN484C?

The LFECP33E-5FN484C positions itself as a high-density, flexible FPGA solution for commercial embedded and communications designs. Its combination of 32,800 logic elements, substantial on-chip RAM, multiple DSP blocks and 360 I/Os in a compact fpBGA package supports integration of complex datapaths, memory interfaces and multi-standard I/O on a single device.

Engineers targeting cost-sensitive, mainstream FPGA applications will find a balanced feature set for DSP acceleration, memory interfacing and protocol bridging, backed by the LatticeECP family’s system-level capabilities such as multiple PLLs and flexible sysI/O buffering.

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