LFECP33E-5F484C

The LFECP33E-5F484C is an ECP field programmable gate array (FPGA) IC offered in a 484‑ball BGA package. It provides a mid-to-high logic capacity with substantial on‑chip memory and a large number of general-purpose I/O pins, delivered in a surface-mount 484‑FPBGA (23×23) package.

Key hardware characteristics include 32,800 logic cells, approximately 0.43 Mbits of embedded memory, 360 I/O pins, and a nominal supply range of 1.14 V to 1.26 V. The device is specified for commercial-grade operation from 0 °C to 85 °C and is RoHS compliant.

Key Features

• Core Logic Capacity — 32,800 logic cells provide sizable programmable logic resources for custom digital functions and control logic.
• Logic Blocks — 4,096 logic blocks (as listed in the device specification) support structured implementation of logic partitions and resource distribution.
• Embedded Memory — Approximately 0.43 Mbits of on‑chip RAM available for buffering, FIFOs, and small lookup tables.
• High I/O Count — 360 configurable I/O pins for wide peripheral interfacing and parallel bus connectivity.
• Power — Low-voltage core operation with a supply range of 1.14 V to 1.26 V suitable for modern low-voltage systems.
• Package and Mounting — 484‑BBGA (supplier package: 484‑FPBGA, 23×23) in a surface-mount form factor for compact PCB integration.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

• High‑density I/O systems — Leverage the 360 I/O pins to handle multi-channel interfaces, parallel buses, or complex board-level I/O routing.
• Memory‑assisted data paths — Use the approximately 0.43 Mbits of embedded RAM for buffering, queuing, and small on‑chip data storage in streaming or packetized designs.
• Compact, surface‑mount designs — The 484‑FPBGA (23×23) package enables integration into space-constrained PCBs while maintaining significant logic capacity.
• Commercial electronic products and prototypes — Suited for commercial-grade systems requiring reprogrammable logic with mid-range density and I/O counts.

Unique Advantages

• Substantial logic resources: 32,800 logic cells offer room for complex control, signal processing, and glue logic without external ASICs.
• Large I/O complement: 360 I/O pins reduce the need for external I/O expanders and simplify board-level connectivity.
• Embedded memory on‑chip: Approximately 0.43 Mbits of RAM supports local buffering and state storage, reducing external memory dependency for many use cases.
• Compact BGA packaging: 484‑BBGA / 484‑FPBGA (23×23) enables high-density PCB layouts while maintaining solderable surface-mount assembly.
• Low-voltage core operation: 1.14 V to 1.26 V supply range aligns with modern low-power system domains.
• RoHS compliant: Meets environmental compliance requirements for mainstream manufacturing workflows.

Why Choose LFECP33E-5F484C?

The LFECP33E-5F484C is positioned for designs that require a balance of logic density, embedded memory, and extensive I/O in a compact surface-mount BGA package. Its combination of 32,800 logic cells, roughly 0.43 Mbits of on‑chip RAM, and 360 I/Os makes it a strong option for commercial electronic products and prototypes where reprogrammable logic and board-level integration are priorities.

With a focused supply voltage range and commercial temperature rating, this FPGA is suited to applications that demand reliable, medium-to-high complexity programmable logic in standard commercial environments while maintaining RoHS compliance for production readiness.

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