LFECP33E-4F484C

The LFECP33E-4F484C is a commercial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a mid-density programmable fabric with a combination of logic, embedded memory and high I/O count suitable for commercial embedded designs.

Key hardware attributes include 32,800 logic elements, approximately 0.43 Mbits of on-chip RAM, and up to 360 I/O pins, packaged in a 484-ball BGA for surface-mount assembly. The device operates from a 1.14 V to 1.26 V supply and supports 0 °C to 85 °C operating temperature.

Key Features

• Core Logic — 32,800 logic elements provide a medium-density programmable fabric for custom logic, glue-logic and control functions.
• Logic Blocks — 4,096 logic blocks enable structured placement of combinational and sequential logic resources across the device.
• On-chip Memory — Approximately 0.43 Mbits (434,176 bits) of embedded RAM to support buffering, state storage and small lookup-table needs.
• I/O Capacity — Up to 360 general-purpose I/O pins to support multi-channel interfaces and parallel connectivity.
• Power — Operates from a core supply range of 1.14 V to 1.26 V for defined power budgeting and regulator selection.
• Package & Mounting — Supplied in a 484-ball BGA (supplier package: 484-FPBGA, 23×23) for compact surface-mount PCB integration.
• Environmental & Grade — Commercial-grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Embedded Control — Use as a programmable controller or glue logic in commercial embedded systems that require configurable finite state machines and custom peripherals.
• I/O Expansion & Bridging — High I/O count enables parallel interfacing, protocol bridging or I/O aggregation tasks on compact boards.
• Prototyping & Evaluation — Medium-density logic and on-chip RAM make the device suitable for hardware prototyping and functional validation of custom logic blocks.
• Communications Endpoints — Can be applied in endpoint devices that require custom packet handling, buffering and I/O routing within a commercial temperature range.

Unique Advantages

• Balanced Density and I/O: 32,800 logic elements combined with 360 I/O pins deliver a balance between programmable logic capacity and external connectivity for compact designs.
• Embedded Memory for Local Storage: Approximately 0.43 Mbits of on-chip RAM reduces the need for external memory for small buffers and state storage.
• Compact BGA Package: The 484-ball BGA (23×23) provides a space-efficient footprint for densely routed PCBs and surface-mount manufacturing.
• Defined Power Window: A narrow core voltage range (1.14 V–1.26 V) simplifies power supply design and margining for the core rail.
• Commercial Temperature Rating: Qualified for 0 °C to 85 °C operation and RoHS compliant, suitable for a wide range of commercial applications.

Why Choose LFECP33E-4F484C?

The LFECP33E-4F484C positions itself as a practical, commercial-grade FPGA option where a balance of logic density, embedded memory and high I/O count is required. Its specifications support designs that need significant programmable logic and I/O without the footprint and power of larger FPGAs.

This device is well suited for engineering teams developing commercial embedded systems, interface logic, or prototype platforms that benefit from integrated memory, defined supply requirements and a compact BGA package. RoHS compliance and the specified operating temperature range help streamline integration into commercial product designs.

Request a quote or submit an inquiry to receive pricing and availability for the LFECP33E-4F484C and to discuss how this FPGA can fit your next commercial design.