LFECP33E-3FN672C

The LFECP33E-3FN672C is a Lattice Semiconductor ECP-series FPGA offered in a 672-ball BGA package. It provides a balanced mix of programmable logic, embedded memory and high-density I/O for mainstream, cost-sensitive FPGA applications.

Designed for applications that require substantial I/O and on-chip resources, this device combines 32,800 logic elements, approximately 0.43 Mbits of embedded RAM, and up to 496 I/O pins in a surface-mount 27 × 27 mm package.

Key Features

• Programmable Logic  32,800 logic elements suitable for complex combinational and sequential logic implementations.
• Embedded Memory  Total on-chip RAM of 434,176 bits — approximately 0.43 Mbits of embedded memory for data buffering, FIFOs and small caches.
• I/O Density  496 user I/Os provide extensive external connectivity for parallel interfaces, control signals and high-pin-count designs.
• Package and Mounting  672-ball FPBGA package (27 × 27 mm), surface-mount for high-density board designs and reliable soldered connections.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power rails and enable predictable power budgeting.
• Operating Range  Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for many consumer and industrial-control environments.
• Standards and Compliance  RoHS-compliant, supporting environmentally conscious manufacturing and regulatory requirements.
• Family-level Capabilities  As part of the LatticeECP family, the device benefits from architecture features such as flexible I/O buffer support for common interface standards, dedicated DDR memory interface support, and up to four analog PLLs (family-level).

Typical Applications

• Networking and Communications  High I/O count and on-chip memory make the device suitable for protocol bridging, packet buffering and interface adaptation tasks.
• Embedded Processing  Combine logic elements and embedded RAM for custom control functions, signal conditioning, and hardware-accelerated tasks.
• Memory Interface and Controllers  Family support for dedicated DDR interfaces enables implementation of external memory controllers and data buffering.

Unique Advantages

• High Logic Capacity: 32,800 logic elements provide headroom for sizeable HDL designs without requiring multiple devices.
• Large I/O Count: 496 I/Os simplify board-level routing by accommodating wide parallel buses and multiple interfaces on a single FPGA.
• Compact, High-density Package: 672-ball BGA in a 27 × 27 mm footprint enables dense system integration while preserving routing resources.
• Predictable Power Envelope: Narrow core voltage range (1.14–1.26 V) helps with power supply selection and thermal planning.
• Regulatory Compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose LFECP33E-3FN672C?

The LFECP33E-3FN672C positions itself as a feature-rich, commercially graded FPGA for designers who need a combination of substantial logic resources, significant I/O counts and embedded RAM in a compact BGA package. Its specification set supports a wide range of mainstream applications where integration density, predictable power requirements and platform flexibility matter.

Backed by the Lattice ECP family architecture and ecosystem, the device offers a clear upgrade path and design support for teams developing communications interfaces, embedded controllers and memory-centric functions.

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