LFECP33E-3F484C

The LFECP33E-3F484C is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation designed for commercial applications that require flexible on-chip logic and I/O. It provides a balance of programmable logic, embedded memory and high I/O count in a compact ball-grid array package.

With 32,800 logic elements, approximately 0.434 Mbits of embedded RAM and 360 general-purpose I/Os, this device targets designs that need moderate logic capacity, substantial I/O connectivity and low-voltage operation (1.14 V to 1.26 V) within a 0 °C to 85 °C operating range.

Key Features

• Core Logic 32,800 logic elements for implementing custom logic, state machines and glue logic in programmable hardware.
• Embedded Memory Approximately 0.434 Mbits of on-chip RAM for buffering, small lookup tables and local data storage.
• I/O Capacity 360 device I/Os to support multiple external interfaces and parallel connections without immediate need for external I/O expanders.
• Package 484-BBGA device in a 484-FPBGA supplier package (23×23) for high pin density in a compact surface-mount footprint.
• Power Low-voltage core supply range of 1.14 V to 1.26 V to match modern low-voltage system rails.
• Operating Range Commercial-grade operation from 0 °C to 85 °C for standard commercial environments.
• Mounting Surface-mount package suitable for modern PCB assembly processes.
• Environmental RoHS-compliant for regulatory and manufacturing requirements.

Typical Applications

• Embedded Control Use for implementing control logic and custom peripheral interfaces in commercial embedded systems where moderate logic capacity and numerous I/Os are required.
• Communications Equipment Suitable for protocol bridging, parallel interface handling and custom packet processing that benefit from flexible I/O and on-chip memory.
• Prototyping and Development Well-suited to hardware prototyping workflows where reprogrammable logic and rapid iteration are needed to validate designs.
• Consumer and Commercial Electronics Implement user interface control, peripheral aggregation and custom timing functions in consumer or commercial products operating within the specified temperature and voltage ranges.

Unique Advantages

• Substantial Logic Capacity: 32,800 logic elements enable complex logic implementations without immediate reliance on external ASICs or multiple FPGAs.
• High I/O Density: 360 I/Os provide flexibility to connect sensors, peripherals and parallel interfaces directly to the FPGA, reducing the need for additional multiplexing components.
• On-Chip Memory: Approximately 0.434 Mbits of embedded RAM supports local buffering and lookup tables, simplifying board-level memory architecture.
• Compact, High-Pin Package: 484-BBGA (484-FPBGA 23×23) delivers many signals in a space-efficient surface-mount form factor for dense PCB layouts.
• Low-Voltage Operation: 1.14 V to 1.26 V core supply compatibility with modern low-voltage system rails helps streamline power supply design.
• RoHS Compliance: Environmentally compliant manufacturing and assembly alignment for commercial product production.

Why Choose LFECP33E-3F484C?

The LFECP33E-3F484C positions itself as a versatile commercial-grade FPGA offering a balance of logic density, embedded memory and extensive I/O in a compact BBGA package. Its specifications make it a practical choice for designers who need reprogrammable logic capacity, local RAM and many external connections while operating at low core voltages.

This device suits teams and projects focused on commercial embedded systems, communications equipment and hardware prototyping that require scalable logic resources, a dense pinout and RoHS compliance. Its combination of features helps streamline BOM and PCB design while providing the flexibility inherent to programmable logic solutions.

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