LFECP33E-3F484I

The LFECP33E-3F484I is an ECP Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a mid-density FPGA fabric with 32,800 logic elements, 360 user I/O pins and on-chip RAM to support a wide range of embedded logic and interfacing tasks.

Designed for surface-mount applications and rated for industrial temperature operation, this device offers a compact 484-BBGA package and low-voltage core operation for space-constrained, temperature-demanding systems.

Key Features

• Core Logic 32,800 logic elements (cells) provide programmable logic capacity for glue logic, datapath acceleration and custom control functions.
• Embedded Memory 434,176 bits of on-chip RAM (approximately 0.41 Mbits) to implement FIFOs, buffers and small memory structures without external SRAM.
• I/O Density 360 general-purpose I/O pins to support multiple parallel interfaces, sensor arrays and mixed-signal front-end connectivity.
• Power Range Core supply operation from 1.14 V to 1.26 V to match low-voltage system rails and reduce power dissipation in modern designs.
• Package & Mounting 484-BBGA (supplier device package: 484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact PCB layouts.
• Temperature & Grade Industrial operating temperature range of −40 °C to 100 °C and RoHS compliance for deployment in industrial-class environments.

Typical Applications

• Industrial Control Systems Use the FPGA to implement custom control logic, I/O aggregation and deterministic signal processing within industrial temperature environments.
• High‑Density I/O Designs Leverage 360 I/O pins for multi-channel sensor interfacing, parallel data capture or multi-protocol bridging on a single device.
• Embedded Logic and Glue Deploy the 32,800 logic elements and on-chip RAM to consolidate discrete logic, offload microcontroller tasks, or implement custom peripherals.

Unique Advantages

• Significant Logic Capacity: 32,800 logic elements allow complex state machines, datapath functions and logic consolidation in one FPGA.
• On‑Chip Memory: 434,176 bits (~0.41 Mbits) of embedded RAM reduce or eliminate the need for small external memory devices, simplifying BOM and layout.
• High I/O Count: 360 I/O pins support dense peripheral and sensor connections without external expanders, streamlining system design.
• Industry‑Grade Thermal Range: −40 °C to 100 °C operating range supports deployment in temperature-challenging industrial applications.
• Compact BGA Footprint: 484-BBGA (23 × 23 mm) surface-mount package balances high pin count with a compact PCB footprint for space-constrained systems.
• Low‑Voltage Core Operation: 1.14 V to 1.26 V supply range aligns with modern low-voltage systems to help control power consumption.

Why Choose LFECP33E-3F484I?

The LFECP33E-3F484I positions itself as a mid-density, industrial‑grade FPGA solution that combines substantial logic capacity, extensive I/O and integrated RAM in a compact 484-BBGA package. Its low-voltage core operation and wide operating temperature range make it suitable for robust embedded designs where board space, I/O count and thermal tolerance are key considerations.

Manufactured by Lattice Semiconductor Corporation and RoHS compliant, the device is suited for system designers seeking a single-device solution to consolidate logic, handle multiple interfaces and operate reliably across industrial temperature conditions.

Request a quote or submit a purchasing inquiry for LFECP33E-3F484I to obtain pricing, availability and lead-time information.