LFECP20E-5FN484C
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA |
|---|---|
| Quantity | 914 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 360 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 19700 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 434176 |
Overview of LFECP20E-5FN484C – ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA
The LFECP20E-5FN484C is a Lattice ECP-series FPGA in a 484-ball BGA package optimized for mainstream, cost-sensitive FPGA applications. It integrates a mid-range logic fabric with substantial on-chip RAM and a high I/O count to support complex embedded systems, signal processing, and high-density I/O designs.
This commercial-grade device delivers 19,700 logic elements, approximately 0.434 Mbits of embedded RAM, and up to 360 user I/Os in a 23 × 23 mm 484-FPBGA package, offering a compact, surface-mount solution for board-level integration. It operates from a core supply range of 1.14 V to 1.26 V and is RoHS compliant.
Key Features
- Core Logic 19,700 logic elements provide mid-range programmable logic capacity for control, glue logic, and moderate-density processing tasks.
- Programmable Fabric Density Device-level programmable fabric includes 2,464 programmable units consistent with the LatticeECP family architecture.
- Embedded Memory Approximately 0.434 Mbits (434,176 bits) of on-chip RAM supports data buffering, small tables, and local storage without external memory.
- I/O and Packaging Up to 360 user I/Os in a 484-ball fpBGA (23 × 23 mm) footprint, surface-mount package suited for compact, high-density boards.
- Power and Temperature Core voltage range 1.14 V to 1.26 V; commercial operating temperature 0 °C to 85 °C.
- Series-Level System Features Family features include dedicated DSP blocks, flexible I/O buffer standards, dedicated DDR interface support, multiple PLLs, IEEE 1149.1 boundary-scan, and SPI boot flash interface (series-level capabilities as documented for the LatticeECP family).
- Compliance RoHS compliant for environmental and manufacturing compatibility.
Typical Applications
- Embedded control and glue logic Use the device’s 19,700 logic elements and abundant I/Os to implement custom control, protocol bridging, and board-level orchestration.
- Signal processing and DSP functions Series-level DSP blocks and on-chip memory enable acceleration of moderate-throughput DSP algorithms and data manipulation tasks.
- Memory interface and buffering On-chip RAM and family DDR interface support simplify designs that require local buffering or intermediate data storage.
- High-density I/O applications 360 user I/Os in a compact fpBGA package make this device suitable for systems requiring many parallel interfaces or mixed-signal front-end connections.
Unique Advantages
- Balanced mid-range capacity: 19,700 logic elements and 434,176 bits of on-chip RAM provide a practical balance of logic and memory for mainstream designs without unnecessary overhead.
- High I/O density in a compact package: 360 I/Os in a 23 × 23 mm 484-FPBGA package enable high pin-count designs in space-constrained layouts.
- Embedded system support: Series-level features such as PLLs, boundary-scan, and SPI boot flash interface facilitate system integration and in-field programming.
- Commercial-grade reliability: Commercial operating range (0 °C to 85 °C) and RoHS compliance align with standard production and environmental requirements.
- Power-optimized core: Narrow core supply window (1.14 V–1.26 V) supports predictable power planning for board-level power distribution.
Why Choose LFECP20E-5FN484C?
The LFECP20E-5FN484C positions itself as a practical, mid-range FPGA choice for developers needing a compact, high-I/O, commercially graded device with meaningful on-chip RAM and DSP-capable series features. Its combination of approximately 19,700 logic elements, ~0.434 Mbits of embedded RAM, and 360 I/Os in a 484-ball fpBGA package supports a wide range of embedded, signal-processing, and I/O-rich designs while simplifying BOM and board layout.
Engineers and procurement teams targeting mainstream applications that require a balance of logic density, memory, and I/O count will find this Lattice ECP-series device a suitable option, backed by the documented series-level features and a clear electrical and thermal specification set.
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