LFECP20E-4FN484I

The LFECP20E-4FN484I is an industrial-grade, surface-mount FPGA supplied in a 484-ball BGA package. It provides a mid-to-high density programmable fabric with substantial I/O and embedded memory resources suitable for mainstream embedded and industrial applications that require flexible logic, on-chip RAM and broad I/O connectivity.

Designed as part of the LatticeECP family, this device targets designs where a balance of logic capacity, memory and I/O count supports integration of system-level functions while enabling low-voltage operation and extended temperature range.

Key Features

• Logic Capacity — 19,700 logic elements (cells) and 2,464 logic blocks, giving designers significant programmable resources for mid-density designs.
• Embedded Memory — 434,176 total on-chip RAM bits (approximately 0.434 Mbits) for embedded storage, buffering and local data processing.
• I/O Density — 360 user I/Os to support multi-channel interfaces, bus structures and wide peripheral connectivity.
• Power — Core voltage range of 1.14 V to 1.26 V to match low-voltage system domains.
• Package and Mounting — 484-ball BBGA (supplier package listed as 484-FPBGA, 23×23 mm) in a surface-mount form factor for compact board layouts.
• Temperature Grade — Industrial operating temperature range from −40°C to 100°C for deployment in demanding environments.
• Compliance — RoHS compliant, supporting environmental and lead-free requirements.

Typical Applications

• Industrial Control and Automation — Programmable logic and embedded memory enable real-time control, sequencing and I/O aggregation for factory and process automation systems.
• Communications and Networking — High I/O count and ample logic elements support protocol bridging, packet processing and interface consolidation in telecom and network equipment.
• Embedded Processing and Offload — On-chip RAM and logic resources allow acceleration of compute tasks, buffering and custom data-path implementations within embedded systems.
• Instrumentation and Test Equipment — Flexible I/O and reprogrammable logic make the device suitable for signal conditioning, data acquisition front ends and custom measurement functions.

Unique Advantages

• Balanced Resource Mix: Combines approximately 19,700 logic elements with roughly 0.434 Mbits of embedded memory to support both logic-intensive and memory-buffering needs without external components.
• High I/O Capacity: 360 I/Os enable wide parallel interfaces, multi-channel sensors or aggregated bus connections, reducing the need for external multiplexers or GPIO expanders.
• Industrial Reliability: Rated for −40°C to 100°C operation and supplied in a surface-mount BGA package suited to ruggedized systems and compact PCB designs.
• Low-Voltage Operation: Core supply range of 1.14 V to 1.26 V allows integration into low-voltage power domains common in modern systems.
• Compact Packaging: 484-ball BGA (484-FPBGA, 23×23 mm) provides high pin count in a space-efficient footprint for dense board layouts.
• RoHS Compliant: Meets environmental requirements for lead-free and restricted substance regulations.

Why Choose LFECP20E-4FN484I?

The LFECP20E-4FN484I positions itself as a versatile mid-to-high density FPGA for engineers who need a combination of significant logic capacity, substantial on-chip RAM and a high I/O count in an industrial-temperature device. Its low-voltage core and compact 484-ball BGA package make it suitable for space-constrained boards that still demand broad connectivity and reliable operation across extended temperature ranges.

Built within the LatticeECP family, this device is aimed at designs that require flexible hardware programmability with the option to leverage family-level design tools and IP for efficient implementation and long-term scalability.

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