LFECP20E-5F484C

IC FPGA 360 I/O 484FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA

Quantity 347 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O360Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells19700
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits434176

Overview of LFECP20E-5F484C – ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA

The LFECP20E-5F484C is a commercial-grade Field Programmable Gate Array (FPGA) in the LatticeECP family, offering a balanced combination of logic capacity, on-chip memory and I/O density for mainstream embedded and cost-sensitive designs. The device implements approximately 19,700 logic elements and provides substantial on-chip RAM alongside a high I/O count to support complex system interfaces and memory subsystems.

Packaged in a 484-ball BGA (23 mm × 23 mm) and rated for surface-mount assembly, this FPGA operates from a core supply range of 1.14 V to 1.26 V and is specified for commercial temperature operation from 0 °C to 85 °C. It is RoHS compliant.

Key Features

  • Logic Capacity  Approximately 19,700 logic elements and 2,464 logic blocks provide the programmable fabric needed for mid-range FPGA designs.
  • Embedded Memory  Total on-chip RAM of 434,176 bits — approximately 0.434 Mbits of embedded memory — for buffers, FIFOs and small data structures.
  • I/O Density  360 user I/Os support complex peripheral interfacing and multi-channel connectivity in a single device.
  • Power and Supply  Core voltage supply range of 1.14 V to 1.26 V to match system power rails and regulator designs.
  • Package  484-ball fine-pitch BGA (484-FPBGA, 23 × 23 mm) optimized for high I/O count and compact board area.
  • Mounting & Grade  Surface-mount package in a commercial-grade device rated for 0 °C to 85 °C operation.
  • Standards and Compliance  RoHS compliant for environmental regulatory conformity.
  • Family Capabilities  LatticeECP family features (series-level) include options for dedicated DSP blocks, flexible embedded and distributed memory, and multiple PLLs for clocking — enabling designs that require DSP acceleration and complex clock management.

Typical Applications

  • Industrial and Commercial Controls  Programmable logic and I/O density make the device suitable for machine control, protocol bridging and user-interface controllers within commercial temperature ranges.
  • High‑I/O Embedded Systems  With 360 I/Os and ample logic resources, the FPGA is suitable for systems that require multiple parallel interfaces, custom peripheral glue logic or sensor aggregation.
  • Memory Interface and Buffering  On-chip RAM and family-level DDR support are useful for buffering, data alignment and intermediate storage in systems using external memory or streaming data paths.
  • DSP‑Assisted Tasks  Series-level DSP block options and significant logic density support multiply‑accumulate and signal-processing partitions within embedded applications.

Unique Advantages

  • Balanced Logic and Memory:  Approximately 19,700 logic elements paired with ~0.434 Mbits of on-chip RAM supports medium-complexity designs without excessive external memory dependency.
  • High I/O Count:  360 I/Os reduce the need for external interface ICs and simplify board-level routing for multi-channel systems.
  • Compact BGA Package:  The 484-ball FPBGA (23 × 23 mm) delivers high I/O and density in a compact footprint suitable for space-conscious designs.
  • Commercial-Grade Reliability:  Specified operation across 0 °C to 85 °C and RoHS compliance align the part with mainstream commercial electronics and regulatory requirements.
  • Design Ecosystem (Series-Level):  LatticeECP family tooling and IP support (series-level) helps accelerate integration, verification and timing closure for complex designs.

Why Choose LFECP20E-5F484C?

The LFECP20E-5F484C positions itself as a mid-range LatticeECP FPGA that combines substantial logic capacity, a meaningful amount of embedded RAM and a high I/O count in a 484-ball BGA package. These characteristics make it a suitable choice for teams building cost-sensitive, feature-rich embedded systems that require flexible I/O, on-chip buffering and the option to leverage family-level DSP and clocking capabilities.

For engineers and procurement teams, the device offers a clear, verifiable specification set — logic elements, on-chip RAM, I/O count, package, supply and temperature range — that supports predictable BOM and system-level planning while remaining within commercial temperature and compliance requirements.

If you would like pricing, availability or to submit a request for quote for LFECP20E-5F484C, please submit a quote request or contact our sales channel to receive a formal quotation and lead-time details.

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