LFECP20E-5F484C
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA |
|---|---|
| Quantity | 347 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 360 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 19700 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 434176 |
Overview of LFECP20E-5F484C – ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA
The LFECP20E-5F484C is a commercial-grade Field Programmable Gate Array (FPGA) in the LatticeECP family, offering a balanced combination of logic capacity, on-chip memory and I/O density for mainstream embedded and cost-sensitive designs. The device implements approximately 19,700 logic elements and provides substantial on-chip RAM alongside a high I/O count to support complex system interfaces and memory subsystems.
Packaged in a 484-ball BGA (23 mm × 23 mm) and rated for surface-mount assembly, this FPGA operates from a core supply range of 1.14 V to 1.26 V and is specified for commercial temperature operation from 0 °C to 85 °C. It is RoHS compliant.
Key Features
- Logic Capacity Approximately 19,700 logic elements and 2,464 logic blocks provide the programmable fabric needed for mid-range FPGA designs.
- Embedded Memory Total on-chip RAM of 434,176 bits — approximately 0.434 Mbits of embedded memory — for buffers, FIFOs and small data structures.
- I/O Density 360 user I/Os support complex peripheral interfacing and multi-channel connectivity in a single device.
- Power and Supply Core voltage supply range of 1.14 V to 1.26 V to match system power rails and regulator designs.
- Package 484-ball fine-pitch BGA (484-FPBGA, 23 × 23 mm) optimized for high I/O count and compact board area.
- Mounting & Grade Surface-mount package in a commercial-grade device rated for 0 °C to 85 °C operation.
- Standards and Compliance RoHS compliant for environmental regulatory conformity.
- Family Capabilities LatticeECP family features (series-level) include options for dedicated DSP blocks, flexible embedded and distributed memory, and multiple PLLs for clocking — enabling designs that require DSP acceleration and complex clock management.
Typical Applications
- Industrial and Commercial Controls Programmable logic and I/O density make the device suitable for machine control, protocol bridging and user-interface controllers within commercial temperature ranges.
- High‑I/O Embedded Systems With 360 I/Os and ample logic resources, the FPGA is suitable for systems that require multiple parallel interfaces, custom peripheral glue logic or sensor aggregation.
- Memory Interface and Buffering On-chip RAM and family-level DDR support are useful for buffering, data alignment and intermediate storage in systems using external memory or streaming data paths.
- DSP‑Assisted Tasks Series-level DSP block options and significant logic density support multiply‑accumulate and signal-processing partitions within embedded applications.
Unique Advantages
- Balanced Logic and Memory: Approximately 19,700 logic elements paired with ~0.434 Mbits of on-chip RAM supports medium-complexity designs without excessive external memory dependency.
- High I/O Count: 360 I/Os reduce the need for external interface ICs and simplify board-level routing for multi-channel systems.
- Compact BGA Package: The 484-ball FPBGA (23 × 23 mm) delivers high I/O and density in a compact footprint suitable for space-conscious designs.
- Commercial-Grade Reliability: Specified operation across 0 °C to 85 °C and RoHS compliance align the part with mainstream commercial electronics and regulatory requirements.
- Design Ecosystem (Series-Level): LatticeECP family tooling and IP support (series-level) helps accelerate integration, verification and timing closure for complex designs.
Why Choose LFECP20E-5F484C?
The LFECP20E-5F484C positions itself as a mid-range LatticeECP FPGA that combines substantial logic capacity, a meaningful amount of embedded RAM and a high I/O count in a 484-ball BGA package. These characteristics make it a suitable choice for teams building cost-sensitive, feature-rich embedded systems that require flexible I/O, on-chip buffering and the option to leverage family-level DSP and clocking capabilities.
For engineers and procurement teams, the device offers a clear, verifiable specification set — logic elements, on-chip RAM, I/O count, package, supply and temperature range — that supports predictable BOM and system-level planning while remaining within commercial temperature and compliance requirements.
If you would like pricing, availability or to submit a request for quote for LFECP20E-5F484C, please submit a quote request or contact our sales channel to receive a formal quotation and lead-time details.