LFECP20E-3F484I

IC FPGA 360 I/O 484FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA

Quantity 642 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O360Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells19700
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits434176

Overview of LFECP20E-3F484I – ECP Field Programmable Gate Array (FPGA) IC, 360 I/O, 19,700 Logic Elements

The LFECP20E-3F484I from Lattice Semiconductor Corporation is an industrial-grade field programmable gate array (FPGA) designed for configurable digital logic in industrial and embedded systems. It provides a balance of logic capacity, on-chip memory, and a high I/O count in a compact 484-BBGA package, offering a platform for implementing custom interfaces, control logic, and buffering within a constrained footprint.

Key Features

  • Core Logic — 19,700 logic elements to implement complex combinational and sequential logic functions.
  • Embedded Memory — Approximately 0.43 Mbits of embedded memory (434,176 total RAM bits) for FIFOs, buffering, and state storage.
  • I/O Density — 360 user I/O pins to support numerous peripheral interfaces and parallel data paths.
  • Package & Mounting — 484-BBGA package (supplier device package: 484-FPBGA, 23 × 23) with surface-mount mounting for compact board integration.
  • Power — Core supply voltage range of 1.14 V to 1.26 V enabling operation within a defined low-voltage window.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Compliance — RoHS-compliant for regulatory and environmental considerations.

Typical Applications

  • Industrial Control — Implement custom control logic and interface glue in industrial automation and control equipment, leveraging the device’s industrial temperature rating.
  • Embedded System Integration — Provide programmable glue logic, protocol bridging, and peripheral aggregation in compact embedded platforms using the device’s high I/O count and on-chip memory.
  • Data Buffering and Preprocessing — Use embedded RAM for temporary data storage and preprocessing before handing off to host processors or external memory.

Unique Advantages

  • High Logic Capacity: 19,700 logic elements enable implementation of substantial custom logic without external gate arrays.
  • Significant On-Chip Memory: Approximately 0.43 Mbits of embedded RAM supports buffering and state retention without immediate external memory.
  • Extensive I/O: 360 I/O pins allow consolidation of multiple interfaces and sensors on a single device, reducing board-level complexity.
  • Industrial Robustness: −40 °C to 100 °C operating range and industrial grade designation make the device suitable for demanding environments.
  • Compact, Surface-Mount Package: 484-BBGA (23 × 23) minimizes PCB area while supporting high pin counts for dense designs.
  • Low-Voltage Core Operation: 1.14 V to 1.26 V core supply supports integration into modern low-voltage power architectures.

Why Choose LFECP20E-3F484I?

LFECP20E-3F484I delivers a balanced combination of logic resources, embedded memory, and high I/O density in a compact 484-BBGA surface-mount package, positioned for industrial and embedded system designs that require configurable digital logic within a constrained board area. Its specified voltage range and extended temperature rating support deployment in environments where robustness and predictable electrical characteristics are required.

This FPGA is suited to engineers and designers implementing custom interface logic, data buffering, or control functions who need a single-device solution with significant on-chip resources and high pin count. The RoHS compliance and standard package format simplify integration and regulatory alignment in volume production.

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