LFECP15E-5FN256C
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA |
|---|---|
| Quantity | 945 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 195 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 15400 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 358400 |
Overview of LFECP15E-5FN256C – ECP Field Programmable Gate Array (FPGA) IC, 195 I/Os, 358,400 bits RAM, 256-BGA
The LFECP15E-5FN256C is a commercial-grade FPGA from the LatticeECP family optimized for mainstream embedded and signal-processing designs. It combines a programmable FPGA fabric with the LatticeECP architecture to deliver a balance of logic capacity, on-chip memory and flexible I/O in a compact 256-ball fpBGA package.
This device is suited for applications that require moderate logic density, significant on-chip RAM, and a high I/O count while operating within standard commercial temperature ranges.
Key Features
- Logic Capacity Approximately 15,400 logic elements, providing the combinatorial and sequential resources for mid-range FPGA designs.
- On‑Chip Memory Approximately 0.358 Mbits (358,400 bits) of total RAM for embedded data buffering, FIFOs and small memory structures.
- I/O Resources 195 user I/O pins support a wide range of external interfaces and system connectivity requirements.
- Package 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for space-efficient board integration.
- Power Core voltage supply range of 1.14 V to 1.26 V to match system power domains and regulator designs.
- Operating Temperature & Grade Commercial grade with an operating range of 0 °C to 85 °C for standard commercial environments.
- Family Capabilities (LatticeECP) LatticeECP family devices offer dedicated sysDSP blocks, flexible embedded and distributed memory resources, sysCLOCK PLLs and support for dedicated DDR memory interfaces as part of the family architecture.
- Compliance RoHS compliant.
Typical Applications
- Embedded Systems Ideal for control and orchestration logic in embedded platforms that require a blend of logic and on-chip memory.
- Communications and Networking Useful for interface handling, protocol bridging and I/O aggregation where multiple high-pin-count signals must be managed.
- Signal Processing Applicable to mid-range DSP tasks leveraging the LatticeECP family’s dedicated DSP and memory resources for multiply-accumulate and buffering functions.
- Custom Peripherals and Glue Logic Provides the programmable fabric and ample I/O to implement custom peripheral interfaces and system glue logic.
Unique Advantages
- Balanced Logic and Memory 15,400 logic elements combined with approximately 0.358 Mbits of embedded RAM enable practical on-chip data handling without immediate reliance on external memory.
- High I/O Count in a Compact Package 195 I/Os in a 17 × 17 mm 256-FPBGA footprint supports dense I/O routing while conserving board area.
- Family-Level DSP and Memory Features Built on the LatticeECP architecture which includes sysDSP blocks and flexible embedded/block memory options to accelerate signal-processing functions.
- Controlled Power Domain Narrow core voltage range (1.14 V – 1.26 V) simplifies power rail design and regulator selection for the FPGA core.
- Commercial Temperature Suitability Rated for 0 °C to 85 °C to meet commercial product deployment requirements.
- RoHS Compliance Meets RoHS environmental requirements for lead-free assembly processes.
Why Choose LFECP15E-5FN256C?
The LFECP15E-5FN256C offers a pragmatic combination of mid-range logic density, on-chip memory and a high I/O count within a compact 256-ball fpBGA package—making it a strong fit for designers building commercial embedded systems, communications interfaces and mid-level signal-processing solutions. Its placement in the LatticeECP family provides access to family-level features such as dedicated DSP resources, flexible memory options and clocking primitives that simplify system-level design.
Choose this device when you need a commercially graded FPGA that balances integration, I/O capability and on-chip memory while remaining compatible with standard board-level packaging and power architectures.
Request a quote or submit a purchasing inquiry to receive pricing and availability information for LFECP15E-5FN256C.

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