LFECP15E-4FN256I

IC FPGA 195 I/O 256FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA

Quantity 430 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O195Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells15400
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits358400

Overview of LFECP15E-4FN256I – ECP FPGA, 195 I/O, 256-BGA

The LFECP15E-4FN256I is a LatticeECP-series Field Programmable Gate Array (FPGA) offered in a 256-ball fpBGA package (17 × 17 mm). It combines a mid-range programmable fabric with embedded memory and flexible I/O to address mainstream industrial applications that require on-board logic, configurable interfaces, and moderate DSP/memory resources.

This device is specified for industrial operating temperatures and RoHS compliance, and it operates from a 1.14 V to 1.26 V supply range with a -40 °C to 100 °C operating range, making it suitable for robust embedded system designs.

Key Features

  • Programmable Logic  Approximately 15,400 logic elements for implementing custom control, glue logic, finite state machines, and mid-size hardware functions.
  • Fabric Resources  Family-level architecture supports a range of DSP and logic resources; LatticeECP devices include dedicated DSP/multiply-accumulate blocks and a scalable fabric for mainstream FPGA designs.
  • Embedded Memory  Approximately 358,400 bits of on-chip RAM (≈358 kbits / ≈0.358 Mbits) to support FIFOs, buffers, and small on-chip data storage.
  • I/O Capacity  195 user I/Os available in the 256-ball fpBGA package for wide connectivity to peripherals, memories, and sensors.
  • Flexible I/O Standards (family)  LatticeECP family supports a broad set of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS and other differential interfaces.
  • Clocking  Up to four analog PLLs per device (family-level capability) for clock multiplication, division, and phase shifting.
  • Memory Interface Support (family)  Dedicated DDR memory interface logic in the family supports interfaces up to DDR400 (200 MHz).
  • Package & Mounting  256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for compact board integration.
  • Power  Specified supply range 1.14 V to 1.26 V (nominally 1.2 V) to match system voltage rails.
  • Environment & Reliability  Industrial grade device with operating range –40 °C to 100 °C and RoHS compliance for regulated production.
  • System-Level Support (family)  Family features include IEEE 1149.1 boundary scan, SPI boot flash interface, and internal logic analysis tools for in-system debugging.

Typical Applications

  • Industrial Control  Implement machine control, I/O aggregation, and custom timing logic with the device’s logic elements and robust temperature range.
  • Communications Equipment  Use the flexible I/O and on-chip memory for protocol bridging, packet buffering, and interface translation in networking modules.
  • Embedded System Glue Logic  Consolidate discrete logic, peripherals, and interface adaptors into a single programmable device to reduce board BOM and simplify designs.
  • Memory Interface and Buffering  Leverage on-chip RAM and family DDR support for buffering and intermediary memory interfaces between controllers and external memory.

Unique Advantages

  • Balanced Mid-Range Capacity:  Approximately 15,400 logic elements and ~358 kbits of embedded RAM provide a practical balance of logic and memory for mid-size designs.
  • High I/O Count in Compact Package:  195 I/Os in a 17 × 17 mm 256-ball fpBGA enable dense connectivity while minimizing PCB footprint.
  • Industrial Temperature Rating:  Rated from –40 °C to 100 °C to support deployment in temperature-challenging environments.
  • Flexible Power Range:  Operates across a defined 1.14 V to 1.26 V supply window to accommodate nominal 1.2 V systems.
  • System-Level Debug & Boot Support (family):  Boundary scan, SPI boot flash interface, and internal logic analysis capabilities aid development, bring-up, and production diagnostics.
  • RoHS Compliant:  Meets RoHS requirements for environmental and regulatory compatibility.

Why Choose LFECP15E-4FN256I?

The LFECP15E-4FN256I provides a capable mid-range FPGA option in the LatticeECP family, combining substantial programmable logic, embedded RAM, and a high I/O count in a compact 256-ball fpBGA package. Its industrial temperature rating and defined supply range make it suitable for embedded systems that require reliable operation across a wide range of conditions.

This device is well suited for engineers designing control systems, protocol bridging, memory buffering, and other mainstream FPGA applications that benefit from on-chip memory, flexible I/O standards, and family-level DSP and clocking features. The combination of programmable resources and system-level features supports scalable designs with the LatticeECP ecosystem.

Request a quote or submit an inquiry for pricing and availability for LFECP15E-4FN256I to explore integration into your next design.

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