LFECP15E-4FN256I
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA |
|---|---|
| Quantity | 430 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 195 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 15400 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 358400 |
Overview of LFECP15E-4FN256I – ECP FPGA, 195 I/O, 256-BGA
The LFECP15E-4FN256I is a LatticeECP-series Field Programmable Gate Array (FPGA) offered in a 256-ball fpBGA package (17 × 17 mm). It combines a mid-range programmable fabric with embedded memory and flexible I/O to address mainstream industrial applications that require on-board logic, configurable interfaces, and moderate DSP/memory resources.
This device is specified for industrial operating temperatures and RoHS compliance, and it operates from a 1.14 V to 1.26 V supply range with a -40 °C to 100 °C operating range, making it suitable for robust embedded system designs.
Key Features
- Programmable Logic Approximately 15,400 logic elements for implementing custom control, glue logic, finite state machines, and mid-size hardware functions.
- Fabric Resources Family-level architecture supports a range of DSP and logic resources; LatticeECP devices include dedicated DSP/multiply-accumulate blocks and a scalable fabric for mainstream FPGA designs.
- Embedded Memory Approximately 358,400 bits of on-chip RAM (≈358 kbits / ≈0.358 Mbits) to support FIFOs, buffers, and small on-chip data storage.
- I/O Capacity 195 user I/Os available in the 256-ball fpBGA package for wide connectivity to peripherals, memories, and sensors.
- Flexible I/O Standards (family) LatticeECP family supports a broad set of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS and other differential interfaces.
- Clocking Up to four analog PLLs per device (family-level capability) for clock multiplication, division, and phase shifting.
- Memory Interface Support (family) Dedicated DDR memory interface logic in the family supports interfaces up to DDR400 (200 MHz).
- Package & Mounting 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for compact board integration.
- Power Specified supply range 1.14 V to 1.26 V (nominally 1.2 V) to match system voltage rails.
- Environment & Reliability Industrial grade device with operating range –40 °C to 100 °C and RoHS compliance for regulated production.
- System-Level Support (family) Family features include IEEE 1149.1 boundary scan, SPI boot flash interface, and internal logic analysis tools for in-system debugging.
Typical Applications
- Industrial Control Implement machine control, I/O aggregation, and custom timing logic with the device’s logic elements and robust temperature range.
- Communications Equipment Use the flexible I/O and on-chip memory for protocol bridging, packet buffering, and interface translation in networking modules.
- Embedded System Glue Logic Consolidate discrete logic, peripherals, and interface adaptors into a single programmable device to reduce board BOM and simplify designs.
- Memory Interface and Buffering Leverage on-chip RAM and family DDR support for buffering and intermediary memory interfaces between controllers and external memory.
Unique Advantages
- Balanced Mid-Range Capacity: Approximately 15,400 logic elements and ~358 kbits of embedded RAM provide a practical balance of logic and memory for mid-size designs.
- High I/O Count in Compact Package: 195 I/Os in a 17 × 17 mm 256-ball fpBGA enable dense connectivity while minimizing PCB footprint.
- Industrial Temperature Rating: Rated from –40 °C to 100 °C to support deployment in temperature-challenging environments.
- Flexible Power Range: Operates across a defined 1.14 V to 1.26 V supply window to accommodate nominal 1.2 V systems.
- System-Level Debug & Boot Support (family): Boundary scan, SPI boot flash interface, and internal logic analysis capabilities aid development, bring-up, and production diagnostics.
- RoHS Compliant: Meets RoHS requirements for environmental and regulatory compatibility.
Why Choose LFECP15E-4FN256I?
The LFECP15E-4FN256I provides a capable mid-range FPGA option in the LatticeECP family, combining substantial programmable logic, embedded RAM, and a high I/O count in a compact 256-ball fpBGA package. Its industrial temperature rating and defined supply range make it suitable for embedded systems that require reliable operation across a wide range of conditions.
This device is well suited for engineers designing control systems, protocol bridging, memory buffering, and other mainstream FPGA applications that benefit from on-chip memory, flexible I/O standards, and family-level DSP and clocking features. The combination of programmable resources and system-level features supports scalable designs with the LatticeECP ecosystem.
Request a quote or submit an inquiry for pricing and availability for LFECP15E-4FN256I to explore integration into your next design.