LFECP15E-4F484I

The LFECP15E-4F484I is an industrial-grade ECP field programmable gate array designed for system-level integration where a high I/O count and substantial on-chip logic are required. It combines up to 15,400 logic elements with a dense I/O complement and embedded RAM to support control, interfacing, and real-time logic functions in industrial environments.

With a 484-ball BBGA package and a 1.14 V to 1.26 V core supply window, this device targets designs that need robust temperature performance and a compact surface-mount footprint.

Key Features

• Core Logic  Approximately 15,400 logic elements provide the programmable fabric for custom logic, state machines, and glue-logic integration.
• Logic Blocks  1,920 logic blocks support structured logic partitioning and resource distribution across designs.
• Embedded Memory  Approximately 0.36 Mbits of on-chip RAM for buffering, FIFOs, and small data storage without external memory.
• I/O Capacity  352 I/O pins give broad connectivity for parallel interfaces, multiple peripherals, and board-level signal routing.
• Package & Mounting  484-ball BBGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for dense PCB implementations.
• Power  Core voltage range of 1.14 V to 1.26 V to match system power rails and regulator selections.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial deployment temperature requirements.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control  Implement control logic, sensor aggregation, and real-time decision-making leveraging industrial temperature range and high I/O count.
• Protocol Bridging and Interface Logic  Use the device’s dense I/O and programmable logic to translate, aggregate, or route signals between subsystems.
• Embedded System Glue Logic  Replace discrete components by integrating custom timing, state machines, and peripheral interfaces on-chip.
• Data Acquisition and Pre-Processing  Leverage on-chip RAM and logic elements for buffering and preprocessing of sensor or measurement data before transfer to a host.

Unique Advantages

• High Integration Density: 15,400 logic elements and significant I/O reduce external component count and free board space.
• Compact, Board-Level Package: 484-BBGA footprint (484-FPBGA, 23×23) enables high-density PCB designs in a surface-mount package.
• Industrial Temperature Capability: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• Flexible Power Interface: Narrow core voltage window (1.14 V–1.26 V) simplifies power rail design and regulator selection.
• Regulatory Compliance: RoHS compliance supports modern manufacturing and supply-chain requirements.

Why Choose LFECP15E-4F484I?

The LFECP15E-4F484I delivers a balanced combination of programmable logic capacity, substantial I/O, and embedded memory within a compact industrial-grade BGA package. It is well suited for engineers building systems that require on-board logic integration, medium-sized buffering, and reliable operation across a wide temperature range.

This device is a practical choice for teams looking to consolidate discrete components, streamline PCB layouts, and maintain design flexibility through field-programmable logic while adhering to industrial environmental expectations.

Request a quote or submit an inquiry to learn more about availability, lead times, and volume pricing for the LFECP15E-4F484I.