LFECP15E-3FN484I

The LFECP15E-3FN484I is an ECP-class Field Programmable Gate Array from Lattice Semiconductor, offered in a 484-ball BBGA (23 × 23 mm) package for surface-mount assembly. It provides a balance of programmable logic, embedded memory and I/O density suitable for mainstream and cost-sensitive FPGA designs.

This device integrates 15,400 logic elements, approximately 350 Kbits of on-chip RAM, and 352 user I/O pins, delivering the resources needed for mid-density digital signal processing, protocol bridging and system glue logic in industrial applications.

Key Features

• Programmable Logic Capacity — 15,400 logic elements provide mid-density programmable resources for control, processing and glue-logic implementations.
• Embedded Memory — Total on-chip RAM of 358,400 bits (approximately 350 Kbits) for data buffering, FIFOs and small memory structures.
• I/O Density and Flexibility — 352 user I/Os support high pin-count interfaces and complex board-level connectivity.
• Power Supply — Operates from a low-voltage core supply between 1.14 V and 1.26 V, suitable for modern low-voltage systems.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Package and Mounting — 484-ball FBGA (484-BBGA / supplier package 484-FPBGA, 23×23 mm) in a surface-mount form factor for compact board designs.
• RoHS Compliant — Conforms to RoHS requirements for material compliance.
• Family-Level Architecture — As part of the LatticeECP/EC family, the device benefits from family features such as dedicated DSP resources, embedded block RAM, flexible I/O buffer options and multiple PLLs (family-level attributes as described in the LatticeECP/EC data sheet).

Typical Applications

• Industrial Control — Implements custom control logic, interface bridging and sensor aggregation within industrial temperature ranges.
• Signal Processing — Mid-density programmable logic and family DSP resources enable filtering, aggregation and acceleration tasks for embedded signal chains.
• Memory Interface and Buffering — On-chip RAM and family DDR interface support make the device suitable for designs requiring local buffering and memory gateway functions.
• Protocol Bridging and Glue Logic — High I/O count and flexible I/O options allow protocol conversion and board-level interfacing between diverse peripherals and subsystems.

Unique Advantages

• Balanced Resource Mix: Combines 15,400 logic elements with approximately 350 Kbits of on-chip RAM and 352 I/Os to cover a broad set of mid-density designs without overprovisioning.
• Low-Voltage Core: Core supply range of 1.14–1.26 V supports modern low-voltage system architectures and power-optimized designs.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C operation, enabling deployment in thermally challenging environments.
• Compact, High-Pin Package: 484-ball BBGA (23 × 23 mm) delivers high I/O count in a compact surface-mount package suitable for space-constrained PCBs.
• RoHS Compliance: Material compliance reduces supply-chain complexity for regulated markets.
• Family Ecosystem: Leverages LatticeECP/EC family capabilities—such as embedded block RAM, DSP resources, flexible I/O buffers and PLLs—providing a clear upgrade path within the family.

Why Choose LFECP15E-3FN484I?

The LFECP15E-3FN484I is positioned for engineers who need a mid-density FPGA with a practical mix of logic, memory and I/O for mainstream and industrial applications. Its combination of 15,400 logic elements, substantial on-chip RAM and 352 I/Os in a compact 484-BBGA package makes it well suited for designs that require both integration and board-level connectivity within an industrial temperature range.

Choosing this device provides access to the LatticeECP/EC family architecture and its family-level features, offering scalability across related devices while maintaining a predictable footprint and power profile for long-term designs.

If you would like pricing, availability or to request a formal quote, submit an inquiry and our team will respond with the next steps for procurement and technical support.