LFECP20E-3FN484C

IC FPGA 360 I/O 484FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA

Quantity 224 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O360Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells19700
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits434176

Overview of LFECP20E-3FN484C – ECP Field Programmable Gate Array (FPGA) IC, 360 I/O, 484‑BBGA

The LFECP20E-3FN484C is a Lattice ECP‑family Field Programmable Gate Array (FPGA) in a 484‑ball FPBGA package. The device combines an efficient FPGA fabric with dedicated high‑performance functions to address mainstream, cost‑sensitive FPGA applications.

With a midrange logic capacity, embedded memory and dedicated DSP resources, this commercial‑grade device is suitable for designs that require configurable logic, high I/O counts and integrated memory/DDRsupport capabilities within a compact surface‑mount package.

Key Features

  • Logic Capacity  Approximately 19,700 logic elements (logic cells) providing a midrange implementation capacity for user logic and glue functions.
  • On‑chip Memory  Approximately 0.43 Mbits (434,176 bits) of total on‑chip RAM for embedded and distributed memory requirements.
  • Dedicated DSP Resources  6 sysDSP blocks on the LFECP20 device, supporting up to 24 18×18 multipliers for multiply‑accumulate and signal‑processing tasks.
  • I/O and Interface Flexibility  360 user I/Os with programmable sysI/O buffer support for a wide range of standards including LVCMOS (1.2–3.3 V), LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS.
  • Memory Interface Support  Dedicated DDR memory support and on‑chip resources to implement DDR interfaces (device family supports DDR implementations up to DDR400 as described in family documentation).
  • Clocking  Up to four analog PLLs per device to enable clock multiply, divide and phase shifting for system timing requirements.
  • Power  Core supply range specified at 1.14 V to 1.26 V (nominal 1.2 V operation).
  • Package and Mounting  484‑ball FPBGA (23 × 23 mm) surface‑mount package optimized for high I/O count in a compact footprint.
  • Commercial Grade Operation  Operating temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Cost‑sensitive embedded systems  Midrange logic and on‑chip RAM provide configurable control and interface functions for space‑ and cost‑constrained products.
  • Signal processing and DSP  sysDSP blocks and multiple multipliers enable on‑device multiply‑accumulate workloads for filtering, transform and other DSP tasks.
  • Memory interface controllers  Dedicated DDR support and flexible I/O make the device suitable for implementing DDR interfaces and memory controllers.
  • High‑I/O protocol bridging  360 I/Os and wide I/O standard support enable protocol translation, parallel buses and mixed‑I/O systems integration.

Unique Advantages

  • Balanced logic and memory resources: ~19,700 logic elements with approximately 0.43 Mbits of on‑chip RAM to support both control logic and state/data buffering in a single device.
  • Integrated DSP acceleration: Six sysDSP blocks offering multiple 18×18 multipliers to offload compute‑intensive math from external processors.
  • High I/O density in a compact package: 360 I/Os in a 23 × 23 mm 484‑ball FPBGA for designs requiring large numbers of external connections without a large PCB footprint.
  • Flexible interface support: Programmable I/O buffers that support a broad set of standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL, RSDS) to simplify system integration.
  • Robust clocking capabilities: Up to four analog PLLs for clock generation, multiplication, division and phase shifting to meet diverse timing needs.
  • Design ecosystem support: Family documentation references design tools and pre‑designed IP to accelerate implementation and migration across the LatticeECP family.

Why Choose LFECP20E-3FN484C?

The LFECP20E-3FN484C positions itself as a midrange, commercially graded FPGA that balances logic capacity, embedded memory and dedicated DSP resources in a compact 484‑ball FPBGA. It is well suited for designers targeting mainstream, cost‑sensitive applications that require flexible I/O, integrated DDR support and on‑device DSP acceleration.

For development teams and procurement evaluating scalable FPGA options, this LatticeECP‑family device offers a clear combination of integration, I/O density and system clocking resources, supported by the family’s design tools and IP resources for faster implementation and migration.

Request a quote or submit an inquiry to receive pricing, availability and ordering details for the LFECP20E-3FN484C.

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