LFECP20E-3FN484C
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA |
|---|---|
| Quantity | 224 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 360 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 19700 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 434176 |
Overview of LFECP20E-3FN484C – ECP Field Programmable Gate Array (FPGA) IC, 360 I/O, 484‑BBGA
The LFECP20E-3FN484C is a Lattice ECP‑family Field Programmable Gate Array (FPGA) in a 484‑ball FPBGA package. The device combines an efficient FPGA fabric with dedicated high‑performance functions to address mainstream, cost‑sensitive FPGA applications.
With a midrange logic capacity, embedded memory and dedicated DSP resources, this commercial‑grade device is suitable for designs that require configurable logic, high I/O counts and integrated memory/DDRsupport capabilities within a compact surface‑mount package.
Key Features
- Logic Capacity Approximately 19,700 logic elements (logic cells) providing a midrange implementation capacity for user logic and glue functions.
- On‑chip Memory Approximately 0.43 Mbits (434,176 bits) of total on‑chip RAM for embedded and distributed memory requirements.
- Dedicated DSP Resources 6 sysDSP blocks on the LFECP20 device, supporting up to 24 18×18 multipliers for multiply‑accumulate and signal‑processing tasks.
- I/O and Interface Flexibility 360 user I/Os with programmable sysI/O buffer support for a wide range of standards including LVCMOS (1.2–3.3 V), LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS.
- Memory Interface Support Dedicated DDR memory support and on‑chip resources to implement DDR interfaces (device family supports DDR implementations up to DDR400 as described in family documentation).
- Clocking Up to four analog PLLs per device to enable clock multiply, divide and phase shifting for system timing requirements.
- Power Core supply range specified at 1.14 V to 1.26 V (nominal 1.2 V operation).
- Package and Mounting 484‑ball FPBGA (23 × 23 mm) surface‑mount package optimized for high I/O count in a compact footprint.
- Commercial Grade Operation Operating temperature range 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Cost‑sensitive embedded systems Midrange logic and on‑chip RAM provide configurable control and interface functions for space‑ and cost‑constrained products.
- Signal processing and DSP sysDSP blocks and multiple multipliers enable on‑device multiply‑accumulate workloads for filtering, transform and other DSP tasks.
- Memory interface controllers Dedicated DDR support and flexible I/O make the device suitable for implementing DDR interfaces and memory controllers.
- High‑I/O protocol bridging 360 I/Os and wide I/O standard support enable protocol translation, parallel buses and mixed‑I/O systems integration.
Unique Advantages
- Balanced logic and memory resources: ~19,700 logic elements with approximately 0.43 Mbits of on‑chip RAM to support both control logic and state/data buffering in a single device.
- Integrated DSP acceleration: Six sysDSP blocks offering multiple 18×18 multipliers to offload compute‑intensive math from external processors.
- High I/O density in a compact package: 360 I/Os in a 23 × 23 mm 484‑ball FPBGA for designs requiring large numbers of external connections without a large PCB footprint.
- Flexible interface support: Programmable I/O buffers that support a broad set of standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL, RSDS) to simplify system integration.
- Robust clocking capabilities: Up to four analog PLLs for clock generation, multiplication, division and phase shifting to meet diverse timing needs.
- Design ecosystem support: Family documentation references design tools and pre‑designed IP to accelerate implementation and migration across the LatticeECP family.
Why Choose LFECP20E-3FN484C?
The LFECP20E-3FN484C positions itself as a midrange, commercially graded FPGA that balances logic capacity, embedded memory and dedicated DSP resources in a compact 484‑ball FPBGA. It is well suited for designers targeting mainstream, cost‑sensitive applications that require flexible I/O, integrated DDR support and on‑device DSP acceleration.
For development teams and procurement evaluating scalable FPGA options, this LatticeECP‑family device offers a clear combination of integration, I/O density and system clocking resources, supported by the family’s design tools and IP resources for faster implementation and migration.
Request a quote or submit an inquiry to receive pricing, availability and ordering details for the LFECP20E-3FN484C.

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