LFECP15E-5FN484C

The LFECP15E-5FN484C is a commercial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation's ECP family. It delivers a balanced combination of logic density, on-chip memory and high I/O count in a 484-ball fpBGA (23 × 23 mm) package targeted at mainstream and cost-sensitive designs.

Built on the LatticeECP architecture, this device is suited for applications requiring substantial logic resources, flexible I/O support and embedded memory, while operating from a low-voltage core supply and within a commercial temperature range.

Key Features

• Logic Capacity  Approximately 15,400 logic elements, providing a mid-range FPGA fabric for implementing complex glue logic, control and data-path functions.
• On‑Chip Memory  Total on-chip RAM of 358,400 bits (approximately 0.358 Mbits) to support embedded data buffering, state machines and small SRAM structures.
• I/O Resources  Up to 352 user I/Os in the 484-ball fpBGA package, enabling broad external device connectivity and multi-channel interfacing.
• Package & Mounting  484-ball fpBGA (23 × 23 mm) supplied in a surface-mount package for compact, board-level integration.
• Supply Voltage  Core voltage range from 1.14 V to 1.26 V to match low-voltage system power domains.
• Operating Range  Commercial operating temperature from 0 °C to 85 °C suitable for consumer and many industrial-adjacent applications.
• System-Level Support  Family-level features documented in the datasheet include multiple analog PLLs, SPI boot flash support, IEEE 1149.1 boundary-scan and internal logic analysis (ispTRACY™) capabilities.
• DSP & Memory Architecture (Family)  LatticeECP family architecture includes dedicated sysDSP™ blocks and flexible embedded/distributed memory resources (refer to family datasheet for details).
• Regulatory / Environmental  RoHS compliant.

Typical Applications

• Communications and Networking  Protocol bridging, packet buffering and multi‑lane I/O aggregation leveraging high I/O count and embedded memory.
• Embedded Control  Control logic and state machines for consumer and commercial products requiring compact FPGA integration.
• Interfaces and Glue Logic  Level translation, bus bridging and interface adaptation where numerous I/Os and programmable logic are required.

Unique Advantages

• Balanced Logic and Memory  Combines ~15,400 logic elements with ~358 Kbits of on-chip RAM for mixed control and data buffering tasks without external SRAM for many use cases.
• High I/O Density  352 I/Os in a 484-ball fpBGA package enable dense connectivity to peripherals, memories and transceivers on compact PCBs.
• Low-Voltage Core  1.14–1.26 V supply range aligns with modern low-voltage system designs to simplify power distribution.
• Commercial Temperature Rating  0 °C to 85 °C rating supports a wide range of consumer and commercial applications while simplifying thermal design.
• Built for Mainstream Integration  Surface-mount 484-ball fpBGA package provides a compact footprint for space-constrained boards and volume assembly.
• Standards-Based System Features  Family-level support for boundary-scan, SPI boot and PLLs aids system bring-up and flexible clocking without requiring external test-only hardware.

Why Choose LFECP15E-5FN484C?

The LFECP15E-5FN484C places mid-range FPGA resources into a compact 484-ball fpBGA package, offering a practical combination of logic density, on-chip RAM and extensive I/O suitable for mainstream, cost-sensitive embedded designs. Its commercial temperature rating and RoHS compliance make it appropriate for consumer and general commercial products where reliable, integrated programmable logic is required.

Designers seeking a balanced FPGA solution with family-level DSP and memory architecture options, system-level features such as PLLs and SPI boot, and a high I/O count will find this device well matched to projects that need scalable logic and memory without excessive board area or power overhead.

Request a quote or submit a purchase inquiry to evaluate LFECP15E-5FN484C for your next design.