M1A3P250-1PQG208I

The M1A3P250-1PQG208I is a ProASIC3 Field Programmable Gate Array (FPGA) IC designed for mid-density logic integration. It provides 6,144 logic elements, approximately 36,864 bits of on-chip RAM, and up to 151 I/O in a 208-BFQFP package to support a range of embedded and industrial control designs.

With a 1.425 V to 1.575 V supply range, industrial grade qualification, and an operating temperature range from -40 °C to 100 °C, this device is positioned for applications that require integrated logic, on-chip memory, and reliable operation across a wide temperature span.

Key Features

• Core / Logic — 6,144 logic elements (cells) enabling designs up to 250,000 gates for mid-density digital implementations.
• On-Chip Memory — 36,864 bits of embedded RAM (approximately 0.037 Mbits) to support buffering, state machines, and small data storage without external memory.
• I/O — 151 I/O pins to accommodate multiple peripheral interfaces and board-level signal routing needs.
• Power — Operates from a defined supply range of 1.425 V to 1.575 V for predictable power budgeting and integration.
• Package & Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28 × 28 mm) in a surface-mount form factor for PCB assembly compatibility.
• Temperature & Grade — Industrial grade device rated for operation from -40 °C to 100 °C to meet demanding environmental requirements.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement custom control logic, I/O aggregation, and small-scale state machines for equipment operating across -40 °C to 100 °C.
• Embedded System Glue Logic — Replace discrete logic with programmable logic to consolidate functions and simplify board layouts.
• Interface and Signal Conditioning — Provide routing, protocol adaptation, and logic interfacing for systems requiring up to 151 I/O connections.
• Prototyping and Development — Mid-density FPGA resources and on-chip RAM enable functional prototyping of digital subsystems prior to final integration.

Unique Advantages

• Balanced Logic Density: 6,144 logic elements and support for 250,000 gates provide ample capacity for mid-size digital designs without excessive complexity.
• On-Board Memory: Approximately 36,864 bits of embedded RAM reduce the need for external memory for control and buffering tasks, lowering BOM count.
• High Pin Count: 151 I/O pins enable flexible connectivity for multi-sensor systems, peripheral interfaces, and board-level interconnects.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to address designs requiring extended environmental tolerance.
• Compact Surface-Mount Package: 208-BFQFP (28 × 28 mm) provides a high-pin-count footprint suitable for standard PCB assembly processes.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing requirements.

Why Choose M1A3P250-1PQG208I?

The M1A3P250-1PQG208I combines mid-density programmable logic, on-chip memory, and a high I/O count in a single industrial-grade, surface-mount package. Its defined supply range and wide operating temperature make it suitable for embedded and industrial applications where integration, predictable power, and environmental robustness matter.

This device is well suited for engineers and designers seeking a compact, programmable solution to consolidate discrete logic, implement custom interfaces, and accelerate development for systems that require reliable operation across a broad temperature range.

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