M1A3P250-1PQ208I

The M1A3P250-1PQ208I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology, delivering a mid-range programmable logic solution with a balance of I/O, logic capacity, and embedded memory. With 6,144 logic elements and approximately 36,864 bits of on-chip RAM, this device targets industrial applications that require versatile digital integration in a compact surface-mount package.

Engineered for industrial-temperature operation, the device supports a low-voltage core supply range and offers a high I/O count for complex interfacing tasks, making it suitable for systems that need reliable, reconfigurable logic in demanding environments.

Key Features

• Logic Capacity  6,144 logic elements and 250,000 equivalent gates provide mid-range programmable logic resources for implementing combinational and sequential functions.
• Embedded Memory  Approximately 36,864 bits of total on-chip RAM to support data buffering, FIFOs, and small lookup tables within the FPGA fabric.
• I/O Resources  151 general-purpose I/O pins enable broad external interfacing and flexible connectivity for peripheral devices and buses.
• Package and Mounting  208-BFQFP package with supplier device package listed as 208-PQFP (28x28); designed for surface-mount assembly to fit space-constrained board designs.
• Power  Core voltage supply range of 1.425 V to 1.575 V for compatibility with low-voltage system architectures.
• Operating Range  Industrial-grade temperature rating from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial control and automation  Implement moderate-density control logic, I/O aggregation, and interfacing functions within an industrial temperature envelope.
• Communications and protocol bridging  Use the device’s I/O count and on-chip memory for protocol conversion, buffering, and custom interface logic.
• Embedded system integration  Consolidate glue logic, peripheral interfaces, and custom accelerators in a compact surface-mount FPGA package.

Unique Advantages

• Right-sized logic capacity: 6,144 logic elements and 250,000 gates provide sufficient resources for mid-density designs without excess cost or board area.
• High I/O count: 151 I/Os enable broad external connectivity, reducing the need for additional interface components.
• Compact, surface-mount package: 208-BFQFP / 208-PQFP (28x28) packaging supports space-efficient board layouts.
• Industrial temperature rating: Operation from -40 °C to 100 °C supports deployment in temperature-demanding applications.
• Low-voltage core operation: Core supply range of 1.425 V to 1.575 V for compatibility with low-voltage system designs.
• RoHS compliant: Supports environmentally conscious manufacturing and assembly processes.

Why Choose M1A3P250-1PQ208I?

The M1A3P250-1PQ208I offers a balanced combination of programmable logic, on-chip memory, and I/O density tailored for industrial applications that demand reliable, mid-range FPGA capability. Its industrial temperature rating and surface-mount 208-pin package make it a practical choice for compact, rugged designs that require flexible digital integration.

This device is well suited for engineers and procurement teams designing equipment that needs scalable logic resources, extensive I/O, and compliance with RoHS requirements, while maintaining a low-voltage core supply and compact form factor.

Request a quote or submit an inquiry to receive pricing and availability information for the M1A3P250-1PQ208I and support with your design requirements.