M1A3P250-1FG144I

The M1A3P250-1FG144I is a ProASIC3 family FPGA offered in a 144-LBGA package. It provides 6,144 logic elements, approximately 36,864 bits of embedded RAM, and 97 user I/O pins for mid-density programmable logic integration.

Designed for industrial-grade applications, this surface-mount FPGA combines a substantial gate count and on-chip memory with a compact 144-FPBGA (13×13) footprint and an industrial operating temperature range.

Key Features

• Logic Capacity — 6,144 logic elements providing approximately 250,000 gates for implementing custom digital logic functions.
• Embedded Memory — 36,864 bits of on-chip RAM (approximately 0.0369 Mbits) to support buffering, state storage, and small lookup tables without external memory.
• I/O Resources — 97 general-purpose I/O pins to interface with sensors, peripherals, and external devices.
• Power Supply — Specified core voltage range of 1.425 V to 1.575 V to support stable core operation within defined limits.
• Package and Mounting — Available in a 144-LBGA / 144-FPBGA (13×13) package, optimized for surface-mount assembly in compact boards.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet a wide range of environmental conditions.
• Mounting Type — Surface mount device suitable for modern PCB assembly processes.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and regulatory compliance.

Unique Advantages

• Mid-density logic solution: 6,144 logic elements and ~250,000 gates provide a balanced resource set for control, glue logic, and custom peripherals without overcommitting board area.
• On-chip memory for local storage: 36,864 bits of embedded RAM reduce the need for small external memories, simplifying BOM and board routing.
• Ample I/O for peripheral connectivity: 97 I/O pins support multiple interfaces and direct connections to external components, minimizing the need for additional I/O expanders.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsher environments where extended temperature performance is required.
• Compact BGA package: 144-LBGA / 144-FPBGA (13×13) delivers a small board footprint while maintaining adequate thermal and electrical characteristics for system integration.
• Defined core voltage range: The 1.425 V to 1.575 V supply window enables predictable power planning during system design.

Why Choose M1A3P250-1FG144I?

The M1A3P250-1FG144I is positioned as a reliable mid-density FPGA choice for designers who need a balance of logic capacity, embedded memory, and I/O in a compact, industrial-grade package. Its combination of 6,144 logic elements, ~36.9 kbits of on-chip RAM, and 97 I/O makes it suitable for control-centric designs and moderate-complexity programmable logic tasks.

This device offers predictable power and thermal parameters—documented supply and operating-temperature ranges—supporting robust system design and long-term deployment. It is a practical option for engineering teams prioritizing integrated logic, compact packaging, and industrial temperature capability.

Request a quote or contact sales to check availability and pricing for the M1A3P250-1FG144I and to discuss how it fits your project's requirements.