M1A3P250-1FG144

The M1A3P250-1FG144 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides programmable digital logic with 6,144 logic elements and approximately 0.0369 Mbits of embedded memory for compact, application-specific designs. The device targets commercial embedded designs requiring a balance of logic capacity, I/O density and a compact 144-LBGA package.

Key Features

• Core Logic 6,144 logic elements (cells) delivering approximately 250,000 gates of programmable logic for implementing custom digital functions.
• Embedded Memory Total on-chip RAM of 36,864 bits (approximately 0.0369 Mbits) to support small buffers, state machines, and on-chip data storage.
• I/O Capacity 97 user I/O pins to interface with peripherals, sensors, or system buses in moderate-density applications.
• Package & Mounting 144-LBGA, supplier package 144-FPBGA (13×13), surface-mount construction for compact board implementations.
• Power Supported core supply voltage range from 1.425 V to 1.575 V to match system power domains.
• Operating Range & Grade Commercial-grade device specified for operation from 0 °C to 85 °C.
• Compliance RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• Embedded Control Implement custom control logic and state machines using the onboard logic elements and embedded memory.
• Peripheral and Interface Bridging Use the 97 I/Os to adapt, aggregate, or translate signals between system peripherals and external devices.
• Prototype and Low- to Mid-Volume Products Deploy programmable logic in commercial embedded designs where a compact LBGA package and moderate gate count meet product requirements.

Unique Advantages

• Balanced Logic Density: 6,144 logic elements and ~250,000 gates provide a practical balance of capacity for many commercial embedded designs.
• On-Chip Memory: 36,864 bits of embedded RAM enable local data buffering and small lookup tables without external memory.
• High I/O Count for Its Class: 97 user I/Os allow flexible interfacing to sensors, peripherals, and system buses while minimizing external glue logic.
• Compact Package: The 144-LBGA (144-FPBGA 13×13) package supports dense PCB layouts and surface-mount assembly processes.
• Defined Power Envelope: A narrow core supply range (1.425 V–1.575 V) simplifies power supply planning for the FPGA core.
• Commercial Temperature Grade: Specified operation from 0 °C to 85 °C aligns with many mainstream embedded product requirements.

Why Choose M1A3P250-1FG144?

The M1A3P250-1FG144 delivers a combination of programmable logic density, modest embedded memory, and a substantial I/O complement in a compact 144-LBGA package from Microchip Technology. It is well suited for commercial embedded designs that need on-board customization of digital functions, signal interfacing, or protocol bridging without large external component counts.

By combining 6,144 logic elements, approximately 0.0369 Mbits of on-chip RAM, and 97 I/Os, this FPGA provides designers with a practical platform for mid-complexity designs where board space, predictable power requirements, and RoHS compliance are priorities.

Request a quote or submit a procurement inquiry for the M1A3P250-1FG144 to obtain pricing, lead-time and availability information for your design needs.