M1A3P250-1PQ208

The M1A3P250-1PQ208 is a ProASIC3 field programmable gate array (FPGA) offered in a 208‑BFQFP package. It provides a balance of programmable logic, on‑chip memory, and I/O density for commercial electronic designs.

With 6,144 logic elements, approximately 0.037 Mbits of embedded memory, and 151 I/O pins, this device targets commercial applications that require moderate logic capacity, integrated memory, and a compact surface‑mount package.

Key Features

• Core Logic  6,144 logic elements (cells) providing the device's programmable logic resources.
• Logic Capacity  Approximately 250,000 gates of logic capacity suitable for moderate‑complexity implementations.
• Embedded Memory  Approximately 0.037 Mbits of on‑chip RAM (36,864 bits) for data buffering and small lookup tables.
• I/O  151 user I/O pins to support multiple interfaces and peripheral connections.
• Power  Supported supply voltage range of 1.425 V to 1.575 V for core operation.
• Package & Mounting  208‑BFQFP (supplier package 208‑PQFP, 28×28 mm) in a surface‑mount form factor for production PCB assembly.
• Operating Conditions  Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Embedded Control  Implement control logic and state machines for commercial embedded systems requiring moderate configurable logic and on‑chip memory.
• Interface Bridging  Use as a programmable interface layer to connect and manage multiple peripherals through the device's 151 I/O pins.
• Prototyping and Development  Suitable for development platforms and prototypes where surface‑mount packaging and a defined commercial temperature range are acceptable.

Unique Advantages

• Balanced Logic Resources: 6,144 logic elements deliver a practical mix of capacity and predictability for moderate‑complexity designs.
• Integrated Memory: On‑chip RAM (36,864 bits) reduces the need for small external memory components for buffering and LUT storage.
• High I/O Count: 151 I/O pins enable flexible connectivity to peripherals, sensors, and external interfaces.
• Compact Surface‑Mount Packaging: 208‑BFQFP (28×28 mm) provides a readily assembled package compatible with standard PCB manufacturing.
• Commercial Temperature Range: Rated for 0 °C to 85 °C, matching typical commercial electronic product requirements.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose M1A3P250-1PQ208?

The M1A3P250-1PQ208 positions itself as a practical ProASIC3 FPGA option for designers seeking a compact, surface‑mount programmable device with moderate logic density, embedded memory, and extensive I/O. Its specification set makes it suitable for commercial electronic products where integrated logic and flexible interfacing are required.

Choose this device when your design requires a stable commercial‑grade FPGA footprint with known operating voltage and temperature parameters, a defined logic element count, and RoHS compliance for production readiness.

Request a quote or submit an inquiry to get pricing and availability for the M1A3P250-1PQ208. Our team can provide lead‑time and ordering information to support your design and procurement process.