M1A3P250-1PQG208

The M1A3P250-1PQG208 is a ProASIC3 flash-based FPGA from Microchip Technology provided in a 208-BFQFP package. It delivers 250,000 gates of programmable logic, 6,144 logic elements and 36,864 bits of on-chip RAM with up to 151 general-purpose I/O pins, targeting commercial embedded designs that require flexible, reprogrammable logic and system interfacing.

Offered as a surface-mount, commercial-grade device with RoHS compliance, this FPGA supports designs that need a balance of logic density, embedded memory and a defined operating voltage and temperature range for predictable integration into assemblies.

Key Features

• Logic Capacity — 250,000 gates implemented as 6,144 logic elements for custom combinatorial and sequential logic integration.
• Embedded Memory — 36,864 bits of on-chip RAM to support buffers, state machines and small data storage requirements.
• I/O Count — 151 user I/Os to interface with peripherals, buses and external devices.
• Package — 208-BFQFP surface-mount package (supplier device package listed as 208-PQFP, 28×28) for board-level integration.
• Power — Nominal supply domain specified at 1.425 V to 1.575 V for core operation.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant, supporting environmental and regulatory objectives for lead-free assembly.

Typical Applications

• Custom Glue Logic and Bus Bridging — Use the 6,144 logic elements and 151 I/Os to implement interface logic, protocol adapters and bus routing in commercial embedded systems.
• Embedded Control Functions — On-chip RAM and programmable logic enable implementation of control state machines, timing circuits and peripheral management.
• Prototyping and System Integration — Reprogrammable fabric lets engineers validate custom logic and iterate designs before production.

Unique Advantages

• Substantial Logic Density: 250,000 gates and 6,144 logic elements provide capacity for medium-complexity functions without external ASICs or large CPLDs.
• Integrated Memory: 36,864 bits of embedded RAM reduce the need for discrete memory in applications requiring small buffers or local storage.
• High I/O Count: 151 I/Os simplify board-level connectivity and reduce the need for external multiplexing.
• Compact Surface-Mount Package: 208-BFQFP (208-PQFP, 28×28) supports standard PCB assembly processes for commercial products.
• Predictable Power and Thermal Envelope: Defined core voltage range (1.425–1.575 V) and commercial operating temperature (0 °C–85 °C) aid reliable system design and validation.
• RoHS Compliant: Meets common environmental requirements for lead-free manufacturing.

Why Choose M1A3P250-1PQG208?

The M1A3P250-1PQG208 positions itself as a commercially graded, flash-based FPGA option from Microchip Technology that balances logic capacity, embedded memory and I/O resources in a single surface-mount package. Its specified core voltage and operating temperature range make it suitable for commercial embedded designs that require deterministic electrical and thermal characteristics.

This device is appropriate for engineers and procurement teams seeking a reprogrammable logic element with moderate gate and memory resources for glue logic, control functions and system integration—providing a compact, RoHS-compliant building block that aligns with standard assembly and validation flows.

Request a quote or submit an inquiry for M1A3P250-1PQG208 to obtain pricing, availability and additional technical support for your design requirements.