M1A3P1000L-FGG256I

The M1A3P1000L-FGG256I is a ProASIC3L Field Programmable Gate Array (FPGA) IC from Microchip Technology, delivered in a 256-ball L-BGA package. It provides a high-density programmable fabric with 24,576 logic elements and approximately 1,000,000 gates suited for industrial environments.

With 177 I/Os, approximately 0.147 Mbits of embedded memory and a low-voltage supply range of 1.14 V to 1.575 V, this FPGA targets embedded and industrial designs that require configurable logic, flexible I/O and extended temperature operation.

Key Features

• Core Logic Density  24,576 logic elements delivering approximately 1,000,000 gates for implementing custom digital functions and complex state machines.
• Embedded Memory  Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) for buffering, small data tables and internal storage.
• I/O Count  177 user I/O pins to support a wide range of external interfaces and signal connections.
• Power Supply  Operates from 1.14 V to 1.575 V, enabling integration into low-voltage systems and modern power domains.
• Package & Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17×17) with surface-mount implementation for compact board designs.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C, suitable for many industrial and harsh-environment applications.
• RoHS Compliance  RoHS-compliant material status for regulatory alignment in many regions.

Typical Applications

• Industrial Control  Programmable logic for automation, custom control interfaces and field instrumentation where industrial temperature operation is required.
• Embedded Systems  Integration of custom state machines, glue logic and interface bridging in embedded designs with limited board space.
• Communications and I/O Bridging  Flexible I/O count and programmable fabric for implementing protocol converters, data buffering or interface adapters.

Unique Advantages

• High Logic Capacity: 24,576 logic elements and roughly 1,000,000 gates enable substantial on-chip implementation without immediate dependence on external ASICs or discrete logic.
• Flexible I/O Provisioning: 177 available I/Os provide designers with the ability to connect multiple peripherals and interfaces directly to the FPGA fabric.
• Compact, Surface-Mount Package: 256-LBGA (256-FPBGA 17×17) supports dense layouts and minimizes PCB footprint for space-constrained designs.
• Low-Voltage Operation: Support for 1.14 V to 1.575 V supplies aligns the device with contemporary low-power domains and modern system power rails.
• Industrial Reliability: −40°C to 100°C operating range and RoHS compliance make the device suitable for many industrial deployment scenarios.

Why Choose M1A3P1000L-FGG256I?

The M1A3P1000L-FGG256I positions itself as a robust, industrial-grade FPGA option for designers requiring significant programmable logic, a high I/O count and embedded memory in a compact surface-mount package. Its combination of logic density, flexible I/O and extended temperature rating makes it suitable for embedded and industrial projects that demand configurable hardware.

This part is appropriate for teams looking to consolidate custom logic functions on a single device while maintaining compliance with RoHS and supporting low-voltage system architectures. Microchip's ProASIC3L offering provides a predictable platform for designs that need reconfigurable logic with industrial temperature capability.

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