M1A3P1000L-FG256I

The M1A3P1000L-FG256I is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology designed for industrial applications. It delivers a balance of logic capacity, on-chip memory, and I/O density in a compact 256-LBGA package.

With 24,576 logic elements and approximately 0.147 Mbits of embedded memory, this device is suited for industrial and embedded designs that require moderate gate counts, a substantial number of I/Os, and wide operating temperature support.

Key Features

• Core Logic: 24,576 logic elements (cells) providing a programmable fabric capable of implementing custom digital logic functions and moderate-complexity designs.
• On‑Chip Memory: Approximately 0.147 Mbits of embedded RAM for buffering, small lookup tables, and state storage within the FPGA fabric.
• I/O Density: 177 available I/Os to support extensive peripheral interfacing and signal routing in compact system designs.
• Gate Equivalent: 1,000,000 gates for estimating design partitioning and system-level resource planning.
• Power Supply Range: Operates from 1.14 V to 1.575 V, enabling compatibility with low-voltage system rails.
• Package & Mounting: 256-LBGA (supplier package: 256-FPBGA, 17 × 17) in a surface-mount form factor for space-efficient PCB integration.
• Industrial Temperature Rating: Rated for -40 °C to 100 °C operation to meet demanding environmental conditions.
• Regulatory Compliance: RoHS compliant.

Typical Applications

• Industrial Control: Implement control logic, timing, and interface bridging in industrial automation equipment operating across a wide temperature range.
• Embedded Systems: Provide custom logic, peripheral aggregation, and I/O expansion for embedded appliances and instrumentation.
• Signal Conditioning & Interface: Aggregate and route signals between sensors, actuators, and processing units using the device’s 177 I/Os.

Unique Advantages

• Substantial Logic Capacity: 24,576 logic elements allow implementation of moderate-complexity designs without external glue logic.
• On‑Chip Memory for Local Storage: Approximately 0.147 Mbits of embedded RAM reduces the need for small external memory in buffering and LUT applications.
• High I/O Count: 177 I/Os enable versatile interfacing options for multi-sensor or multi-peripheral systems.
• Compact Surface‑Mount Package: 256-LBGA (17 × 17) minimizes PCB footprint while providing high pin density.
• Industrial Temperature Range: -40 °C to 100 °C rating supports deployment in harsh environments.
• Low‑Voltage Operation: Supports systems using low-voltage rails with a supply range of 1.14 V to 1.575 V.

Why Choose M1A3P1000L-FG256I?

The M1A3P1000L-FG256I positions itself as a practical FPGA choice for industrial and embedded designers who need a reliable, compact programmable device with a strong complement of logic, memory, and I/Os. Its combination of 24,576 logic elements, approximately 0.147 Mbits of embedded RAM, and 177 I/Os provides the integration needed to simplify system architectures while maintaining a small PCB footprint.

With an industrial temperature rating and RoHS compliance, this Microchip Technology ProASIC3L device is suitable for deployment in temperature-challenging environments where moderate gate count and flexible I/O are priorities.

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