M1A3P1000L-FGG256

The M1A3P1000L-FGG256 is a ProASIC3L family FPGA from Microchip Technology designed for commercial-grade embedded logic applications. It provides a balance of logic density, on-chip memory and I/O count in a compact 256-LBGA package to support programmable digital designs.

Key architectural attributes include 24,576 logic elements, approximately 147,456 bits of embedded memory, up to 177 I/O pins, and support for low-voltage core operation across a defined commercial temperature range. The device is RoHS compliant and intended for surface-mount PCB assembly.

Key Features

• Logic Capacity 24,576 logic elements (cells) provide deterministic programmable logic resources for implementing custom digital functions and state machines.
• On-Chip Memory 147,456 total RAM bits (approximately 0.15 Mbits) of embedded memory to support buffering, lookup tables, and small data stores within designs.
• I/O Count 177 user I/O pins to interface with peripherals, sensors, or external logic while maintaining a compact board footprint.
• Gate Equivalent 1,000,000 gates, offering a useful reference point for partitioning legacy or new logic into the FPGA fabric.
• Power and Voltage Supports a core voltage supply range of 1.14 V to 1.575 V to match low-voltage system architectures.
• Package and Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17×17) designed for surface-mount assembly on standard PCBs.
• Temperature and Grade Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for general-purpose electronic products.
• Environmental Compliance RoHS compliant to meet common regulatory and manufacturing requirements.

Unique Advantages

• Ample Logic Resources: 24,576 logic elements enable implementation of complex state machines and moderate-density digital subsystems without external CPLDs.
• Integrated Memory: Approximately 0.15 Mbits of on-chip RAM reduce dependence on off-chip memory for small buffers and LUT-based implementations, simplifying board design.
• High I/O Count in Compact Package: 177 I/Os in a 256-LBGA (17×17) package deliver a high pin count while preserving PCB real estate.
• Low-Voltage Core Support: A 1.14 V to 1.575 V supply range aligns with low-voltage digital power domains commonly used in modern systems.
• Commercial-Focused Qualification: Designed for commercial temperature applications (0 °C to 85 °C) for consumer and general embedded products.
• Regulatory Readiness: RoHS compliance simplifies procurement and manufacturing workflow for lead-free assembly processes.

Why Choose M1A3P1000L-FGG256?

The M1A3P1000L-FGG256 positions itself as a versatile FPGA option for commercial embedded designs that require a substantial mix of logic, embedded memory and a broad I/O complement in a space-efficient package. Its combination of 24,576 logic elements, roughly 147,456 bits of RAM and 177 I/Os makes it well suited to designers balancing integration and board-level constraints.

Backed by Microchip Technology, this device offers predictable electrical and thermal parameters—defined core voltage, surface-mount packaging and RoHS compliance—making it appropriate for production deployments where commercial-grade performance and regulatory alignment matter.

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