M1A3P1000L-FG256
| Part Description |
ProASIC3L Field Programmable Gate Array (FPGA) IC 177 147456 256-LBGA |
|---|---|
| Quantity | 129 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 177 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M1A3P1000L-FG256 – ProASIC3L FPGA, 177 I/O, 24,576 Logic Elements, 256-LBGA
The M1A3P1000L-FG256 is a ProASIC3L field programmable gate array (FPGA) IC from Microchip Technology. It delivers a commercial-grade, programmable logic fabric with 24,576 logic elements, approximately 0.147 Mbits of embedded memory and up to 177 general-purpose I/O pins for flexible interfacing.
Designed for surface-mount applications, this device combines mid-range logic density with a compact 256-ball BGA package and a low-voltage supply range, making it suitable for a variety of commercial embedded system designs that require on-chip memory, programmable logic and flexible I/O.
Key Features
- Core Logic 24,576 logic elements provide programmable resources for implementing combinational and sequential logic functions.
- Embedded Memory Approximately 0.147 Mbits of on-chip RAM to support buffering, small data tables and state storage.
- I/O Capacity 177 I/O pins for connecting to peripherals, sensors and system-level interfaces.
- Gate Count 1,000,000 gates enabling substantial logic integration within a single device.
- Power Supply Operates from a 1.14 V to 1.575 V supply range to match low-voltage system domains.
- Package and Mounting Available in a 256-ball LBGA package (supplier package: 256-FPBGA, 17 × 17 mm); designed for surface-mount assembly.
- Operating Temperature Commercial temperature grade rated from 0 °C to 85 °C for use in standard commercial environments.
- Regulatory RoHS compliant.
Typical Applications
- Commercial Embedded Systems Implement control logic and custom peripherals where a mid-density FPGA and flexible I/O are required.
- Interface Bridging Use the device’s 177 I/Os to aggregate and translate between multiple parallel and serial interfaces.
- Prototyping and Development Rapidly iterate hardware functions using programmable logic and on-chip RAM for temporary storage and lookup tables.
Unique Advantages
- High Logic Integration: 24,576 logic elements and 1,000,000 gates enable consolidation of multiple discrete components into a single FPGA.
- Ample I/O for Peripheral Connectivity: 177 I/O pins simplify board-level design by supporting a broad set of external interfaces without additional multiplexing.
- Compact BGA Footprint: 256-ball LBGA (256-FPBGA, 17 × 17 mm) minimizes PCB area while supporting surface-mount assembly processes.
- Low-Voltage Operation: 1.14 V to 1.575 V supply range aligns with modern low-voltage system domains to ease power rail integration.
- Commercial Temperature Rating: Specified 0 °C to 85 °C for reliable operation in standard commercial environments.
- RoHS Compliant: Meets common environmental compliance requirements for commercial product manufacturing.
Why Choose M1A3P1000L-FG256?
The M1A3P1000L-FG256 positions itself as a mid-density, commercial-grade FPGA option within the ProASIC3L family, offering a balance of logic capacity, on-chip memory and extensive I/O in a compact 256-ball BGA. Its specifications make it well suited for engineers who need programmable logic consolidation, moderate embedded memory and broad connectivity in surface-mount designs.
This Microchip Technology device is appropriate for teams designing commercial embedded products where predictable operating temperature, RoHS compliance and a clear voltage supply window are important inputs to system integration and procurement decisions.
Request a quote or submit an inquiry to obtain pricing and availability for the M1A3P1000L-FG256 and to discuss how it can fit into your next commercial FPGA design.

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