M1A3P1000L-1FGG256

IC FPGA 177 I/O 256FBGA
Part Description

ProASIC3L Field Programmable Gate Array (FPGA) IC 177 147456 256-LBGA

Quantity 206 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O177Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M1A3P1000L-1FGG256 – ProASIC3L FPGA, 256-LBGA, 177 I/Os

The M1A3P1000L-1FGG256 is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology supplied in a 256-LBGA package. It delivers a programmable fabric with 24,576 logic elements, approximately 0.147 Mbits of embedded memory and 177 user I/Os, suitable for mid-range programmable logic designs.

Designed for commercial-grade applications, the device operates from a 1.14 V to 1.575 V core supply and supports standard surface-mount PCB assembly in a compact 256-FPBGA (17×17) footprint. RoHS compliance and an operating temperature range of 0 °C to 85 °C make it appropriate for a wide range of general-purpose electronic designs.

Key Features

  • Logic Capacity: 24,576 logic elements (cells) providing up to 1,000,000 gates worth of programmable logic for medium-complexity designs.
  • Embedded Memory: Approximately 0.147 Mbits of on-chip RAM for local buffering, state machines and small data storage needs.
  • I/O Resources: 177 user I/Os to support multiple interfaces and peripheral connections on a single device.
  • Power: Core voltage supply range of 1.14 V to 1.575 V to match system power rails and enable predictable power budgeting.
  • Package and Mounting: 256-LBGA (supplier package 256-FPBGA, 17×17) in a surface-mount form factor for dense PCB integration.
  • Operating Range: Commercial grade with an operating temperature span of 0 °C to 85 °C for typical commercial environments.
  • Compliance: RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

  • Embedded Systems: Implement custom logic, glue logic and peripheral interfacing where 24,576 logic elements and local RAM can consolidate functions onto a single device.
  • Communications Equipment: Use the 177 I/Os to route multiple serial and parallel interfaces and to implement protocol handling in programmable fabric.
  • Industrial Control: Apply the programmable logic and on-chip memory for control algorithms, state machines and sensor interfacing in commercial automation systems.

Unique Advantages

  • Balanced Logic and Memory: Combines 24,576 logic elements with embedded RAM (≈0.147 Mbits) to support integrated control and data buffering without external memory for many mid-range designs.
  • Generous I/O Count: 177 user I/Os allow flexible system partitioning and multiple interface connections from a single device, reducing board-level complexity.
  • Compact Package: 256-LBGA (256-FPBGA, 17×17) enables high-density placement on modern PCBs while maintaining a surface-mount profile.
  • predictable power requirements: A defined core supply range of 1.14 V to 1.575 V simplifies power-supply design and integration into existing systems.
  • Commercial Grade and RoHS Compliant: Suited for general commercial deployments with environmental compliance for standard manufacturing processes.

Why Choose M1A3P1000L-1FGG256?

The M1A3P1000L-1FGG256 positions itself as a solid mid-range FPGA option, offering a balanced combination of logic capacity, on-chip memory and a high I/O count in a compact 256-LBGA package. Its electrical and thermal specifications make it suitable for commercial embedded and control designs where integration and predictable power behavior are priorities.

This Microchip Technology ProASIC3L device is well suited for engineers and procurement teams looking to consolidate peripheral functions, implement custom protocol handling, or prototype programmable logic solutions with a device that supports dense PCB integration and RoHS-compliant manufacturing.

If you would like pricing, availability or a formal quote for M1A3P1000L-1FGG256, please submit a request and our team will respond with details and support options.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up