M1A3P1000L-1FG256I

The M1A3P1000L-1FG256I is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology. It provides a programmable logic fabric with 24,576 logic elements and approximately 1,000,000 gates, designed for industrial-grade embedded applications that require significant I/O and on-chip memory in a compact BGA package.

This device is targeted at designers building I/O‑intensive and industrial systems that need low-voltage operation and reliable temperature performance, while retaining the flexibility of an FPGA for implementing custom logic and interface functions.

Key Features

• Core Logic The device contains 24,576 logic elements (LEs) and approximately 1,000,000 gates for implementing custom digital logic and state machines.
• Embedded Memory Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) for buffers, FIFOs, and small data structures.
• I/O Capacity 177 general-purpose I/O pins support multiple external interfaces and enable designs with significant connectivity requirements.
• Power and Voltage Supported core supply range from 1.14 V to 1.575 V for low-voltage system integration and predictable power planning.
• Package and Mounting Offered in a 256-LBGA package with supplier device package 256-FPBGA (17x17) and designed for surface mount assembly.
• Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for temperature-challenging environments.
• Environmental Compliance RoHS compliant to support regulatory requirements for lead‑free assembly.

Typical Applications

• Industrial Control — Implement custom logic for motor control, PLC interfaces, and deterministic control loops using the device’s industrial temperature rating and substantial logic resources.
• Interface and I/O Bridging — Use the 177 I/Os to aggregate, convert, or bridge multiple peripheral and sensor interfaces in embedded systems.
• Embedded System Logic — Integrate state machines, protocol handlers, and glue logic where moderate on-chip memory and a high count of logic elements are needed.

Unique Advantages

• High Logic Density: 24,576 logic elements and ~1,000,000 gates provide capacity for complex combinational and sequential logic without external ASIC development.
• Significant I/O Count: 177 I/Os enable flexible system partitioning and support for multiple external interfaces, reducing the need for additional I/O expanders.
• Compact BGA Package: 256-LBGA / 256-FPBGA (17x17) provides a small board footprint with a surface-mount form factor suitable for space-constrained designs.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation, enabling deployment in harsh or temperature-variable environments.
• Low-Voltage Core Operation: 1.14 V to 1.575 V supply range supports modern low-voltage system architectures and predictable power budgeting.
• Regulatory Compliance: RoHS compliance facilitates lead-free manufacturing and global assembly requirements.

Why Choose M1A3P1000L-1FG256I?

The M1A3P1000L-1FG256I combines a sizable logic element count, adequate embedded RAM, and a high I/O pin count in a compact industrial-grade BGA package—making it a practical choice for embedded engineers who need programmable logic with robust I/O and temperature resilience. Backed by Microchip Technology, the device fits designs that require deterministic custom logic, interface consolidation, and reliable operation across a wide temperature range.

For teams seeking a scalable, low-voltage FPGA solution that simplifies board-level integration and supports industrial deployment scenarios, this ProASIC3L device offers a balance of logic capacity, connectivity, and package density for long-term product designs.

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