M1A3P1000-PQG208M

The M1A3P1000-PQG208M is a ProASIC3 field programmable gate array (FPGA) supplied in a 208-BFQFP package. It provides a high-density logic fabric with a substantial count of logic elements, on-chip memory, and a large I/O complement for compact, board-mounted designs.

Designed and qualified for military use, this device features MIL-STD-883 qualification and an extended operating temperature range, making it suitable for demanding environments that require rugged, reliable programmable logic.

Key Features

• Logic Capacity 24,576 logic elements provide programmable resources for implementing complex digital functions and custom logic.
• Gate Count Approximately 1,000,000 gates available for dense logic integration and parallel processing architectures.
• Embedded Memory Approximately 0.15 Mbits of on-chip RAM (147,456 bits) for buffering, state storage, and small data tables.
• I/O Density 154 programmable I/Os to support multiple interfaces, signal routing and peripheral connectivity on a single device.
• Power Supply Operates from a core voltage range of 1.425 V to 1.575 V for core power planning and sequencing.
• Packaging & Mounting 208-BFQFP package (supplier package: 208-PQFP, 28 × 28) in a surface-mount form factor for board-level integration.
• Environmental & Qualification Military grade with MIL-STD-883 qualification and RoHS compliance for regulated material requirements.
• Operating Range Rated for −55 °C to 125 °C, supporting operation across extended temperature extremes.

Typical Applications

• Military and Aerospace Systems Military-grade qualification and wide temperature range support deployment in defense and aerospace electronics.
• Rugged Embedded Controllers High logic density and substantial I/O allow integration of control, interface and glue logic in compact embedded boards.
• Instrumentation and Test Equipment On-chip memory and programmable logic enable custom data handling, timing and signal conditioning functions.
• Communications and Interface Bridging Large I/O count and dense logic resources allow implementation of protocol glue, parallel interfaces and custom translators.

Unique Advantages

• Military-Qualified Reliability: MIL-STD-883 qualification and a −55 °C to 125 °C rating provide traceable suitability for high-reliability applications.
• High Logic Integration: 24,576 logic elements and ~1,000,000 gates reduce the need for multiple discrete logic devices, simplifying BOM and PCB layout.
• Substantial On-Chip Memory: Approximately 0.15 Mbits of embedded RAM supports buffering and local data storage without external memory.
• Generous I/O Count: 154 I/Os support multiple interfaces and peripherals directly on-chip, minimizing external components and connectors.
• Board-Level Friendly Package: 208-BFQFP surface-mount packaging in a 28 × 28 supplier footprint offers a compact solution for dense board designs.
• Regulatory Compliance: RoHS compliance supports use in environments with material restriction requirements.

Why Choose M1A3P1000-PQG208M?

The M1A3P1000-PQG208M delivers a balance of high logic density, on-chip memory, and extensive I/O in a military-qualified FPGA package. Its one-million-gate equivalent capacity and 24,576 logic elements enable consolidation of complex digital functions into a single device, while the extended temperature range and MIL-STD-883 qualification address demanding environmental and reliability requirements.

This device is suited for engineers and procurement teams designing rugged embedded systems, defense electronics, and other applications where qualification, integration density, and dependable operation across extreme temperatures are required. Its combination of resources and packaging supports long-term designs that prioritize robustness and compact system-level integration.

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