M1A3P1000-PQG208I

The M1A3P1000-PQG208I is a ProASIC3 family FPGA offering a high-density, flash-based, reprogrammable architecture in a 208-pin BFQFP package. It integrates 24,576 logic elements and 147,456 bits of embedded RAM to address logic- and memory-intensive embedded designs.

Designed for industrial applications, the device provides 154 user I/Os, a core supply range of 1.425 V to 1.575 V, and an operating temperature range of −40 °C to 100 °C, enabling robust use in temperature-demanding environments.

Key Features

• Logic Capacity  24,576 logic elements and approximately 1,000,000 system gates for implementing complex logic and control functions.
• Embedded Memory  147,456 total RAM bits (approximately 0.147 Mbits) of on-chip memory for data buffering and state storage.
• I/O  154 user I/Os with support for mixed-voltage operation as described in the ProASIC3 documentation to accommodate multiple interface standards and bank-selectable voltages.
• Nonvolatile, Flash-Based Configuration  ProASIC3 flash-based, reprogrammable architecture provides instant-on, single-chip nonvolatile configuration retention when powered off.
• Power  Core supply specified at 1.425 V to 1.575 V to support low-voltage, low-power system designs.
• Package & Mounting  208-BFQFP (208-PQFP 28×28) surface-mount package for PCB assembly in space-conscious layouts.
• Industrial Temperature Grade  Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.
• In-System Programming & Security  ProASIC3 family features, as documented, include ISP capability and on-chip AES support for secure configuration (refer to the ProASIC3 datasheet for details).

Typical Applications

• Industrial Control  Implement motor control, PLC logic, and real-time control functions using the device’s dense logic and industrial temperature rating.
• Communications & Networking  Use on-chip RAM and flexible I/O to build protocol bridging, interface controllers, and packet-processing logic.
• Portable and Battery-Backed Systems  Flash-based, reprogrammable nonvolatile configuration and low-voltage core operation make it suitable for designs that require low standby power and instant-on behavior.
• Consumer & Embedded Electronics  Integrate custom peripherals, user interfaces, and glue-logic while minimizing external components.

Unique Advantages

• High Integration:  Large logic element count and substantial embedded RAM reduce external glue logic and off-chip memory needs.
• Nonvolatile Configuration:  Flash-based architecture retains programmed design without external configuration memory, simplifying system boot and reliability.
• Flexible I/O:  154 user I/Os and mixed-voltage support enable direct interfacing to a wide range of peripherals and I/O standards.
• Industrial Readiness:  Specified −40 °C to 100 °C operating range and industrial-grade classification support deployment in harsh environments.
• Compact Packaging:  208-BFQFP surface-mount package provides a high-pin-count solution suitable for two-layer and compact PCBs.

Why Choose M1A3P1000-PQG208I?

The M1A3P1000-PQG208I combines substantial logic capacity, on-chip memory, and a large complement of I/Os in a single, reprogrammable, flash-based FPGA. Its industrial temperature rating and RoHS compliance make it a suitable choice for durable embedded systems where long-term configuration retention, mixed-voltage interfacing, and a compact package are required.

This part is well suited to engineers and teams building control systems, communications interfaces, and embedded devices that benefit from a high level of integration and the flexibility of a reprogrammable FPGA backed by ProASIC3 family technology.

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