M1A3P1000-PQ208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP |
|---|---|
| Quantity | 423 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 154 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M1A3P1000-PQ208I – ProASIC3 FPGA, 154 I/O, 208-BFQFP
The M1A3P1000-PQ208I is a ProASIC3/EL flash-based Field Programmable Gate Array (FPGA) delivered in a 208-BFQFP package. It combines a sizeable logic fabric, on-chip embedded memory, and a broad I/O count to address a range of industrial and embedded system designs.
Designed for low-power operation and platform flexibility, this device is suited for applications that require deterministic logic resources, significant I/O connectivity, and operation across an industrial temperature range.
Key Features
- Core Logic 24,576 logic elements providing a flexible programmable fabric for custom logic and control functions.
- On-Chip Memory Approximately 0.147 Mbits of embedded RAM (147,456 total RAM bits) to support buffering, state machines, and local data storage.
- Gate Count 1,000,000 gates for complex combinational and sequential logic implementations.
- I/O Capacity 154 general-purpose I/O pins to interface with sensors, peripherals, and external logic devices.
- Low-Power Flash Technology Flash-based ProASIC3/EL architecture (Flash*Freeze Technology referenced in the family datasheet) supports non-volatile configuration with low static power consumption.
- Power and Voltage Core supply range: 1.425 V to 1.575 V for predictable power planning and regulator selection.
- Package and Mounting 208-pin BFQFP package (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for PCB integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet typical industrial environmental requirements.
- RoHS Compliant Conforms to RoHS environmental requirements.
Typical Applications
- Industrial Control Implement custom control logic, sequencing, and sensor interfacing using the device's abundant logic elements and I/O capacity.
- Embedded System Glue Logic Bridge peripherals and processors with high-density I/O and local memory for protocol handling, timing, and data buffering.
- Communication Interfaces Implement deterministic protocol translators, parallel/serial interfacing, and custom timing logic leveraging the FPGA fabric and RAM.
- Instrumentation and Test Build configurable signal processing front-ends, trigger logic, and test controllers that benefit from reprogrammability and non-volatile configuration.
Unique Advantages
- Non-volatile Flash Configuration: Flash-based configuration simplifies field deployment with retained programming after power cycles.
- Substantial Logic Capacity: 24,576 logic elements allow consolidation of multiple glue-logic functions into a single device, reducing BOM count.
- Embedded Memory for Local Storage: Approximately 0.147 Mbits of RAM supports buffering and state retention without external memory.
- Wide I/O Count: 154 I/O pins enable broad peripheral connectivity and flexible board-level routing.
- Industrial-Grade Operation: −40 °C to 100 °C operating range addresses typical industrial thermal environments.
- Compact Surface-Mount Package: 208-pin BFQFP (28×28 PQFP) provides a balance of pin count and PCB footprint for dense designs.
Why Choose M1A3P1000-PQ208I?
The M1A3P1000-PQ208I positions itself as a practical choice for engineers needing a flash-configured FPGA with a strong mix of logic density, I/O resources, and on-chip memory within an industrial temperature envelope. Its flash-based ProASIC3/EL architecture provides non-volatile configuration while enabling low static power operation.
This device fits designs that require consolidation of discrete logic, flexible peripheral interfacing, and reliable operation across a broad temperature range. Its combination of programmable resources and package options supports scalable development and long-term deployment in industrial and embedded systems.
Request a quote or submit a sales inquiry for the M1A3P1000-PQ208I to receive pricing and availability information tailored to your project needs.

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