M1A3P1000-PQ208I

IC FPGA 154 I/O 208QFP
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP

Quantity 423 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O154Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M1A3P1000-PQ208I – ProASIC3 FPGA, 154 I/O, 208-BFQFP

The M1A3P1000-PQ208I is a ProASIC3/EL flash-based Field Programmable Gate Array (FPGA) delivered in a 208-BFQFP package. It combines a sizeable logic fabric, on-chip embedded memory, and a broad I/O count to address a range of industrial and embedded system designs.

Designed for low-power operation and platform flexibility, this device is suited for applications that require deterministic logic resources, significant I/O connectivity, and operation across an industrial temperature range.

Key Features

  • Core Logic 24,576 logic elements providing a flexible programmable fabric for custom logic and control functions.
  • On-Chip Memory Approximately 0.147 Mbits of embedded RAM (147,456 total RAM bits) to support buffering, state machines, and local data storage.
  • Gate Count 1,000,000 gates for complex combinational and sequential logic implementations.
  • I/O Capacity 154 general-purpose I/O pins to interface with sensors, peripherals, and external logic devices.
  • Low-Power Flash Technology Flash-based ProASIC3/EL architecture (Flash*Freeze Technology referenced in the family datasheet) supports non-volatile configuration with low static power consumption.
  • Power and Voltage Core supply range: 1.425 V to 1.575 V for predictable power planning and regulator selection.
  • Package and Mounting 208-pin BFQFP package (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for PCB integration.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet typical industrial environmental requirements.
  • RoHS Compliant Conforms to RoHS environmental requirements.

Typical Applications

  • Industrial Control Implement custom control logic, sequencing, and sensor interfacing using the device's abundant logic elements and I/O capacity.
  • Embedded System Glue Logic Bridge peripherals and processors with high-density I/O and local memory for protocol handling, timing, and data buffering.
  • Communication Interfaces Implement deterministic protocol translators, parallel/serial interfacing, and custom timing logic leveraging the FPGA fabric and RAM.
  • Instrumentation and Test Build configurable signal processing front-ends, trigger logic, and test controllers that benefit from reprogrammability and non-volatile configuration.

Unique Advantages

  • Non-volatile Flash Configuration: Flash-based configuration simplifies field deployment with retained programming after power cycles.
  • Substantial Logic Capacity: 24,576 logic elements allow consolidation of multiple glue-logic functions into a single device, reducing BOM count.
  • Embedded Memory for Local Storage: Approximately 0.147 Mbits of RAM supports buffering and state retention without external memory.
  • Wide I/O Count: 154 I/O pins enable broad peripheral connectivity and flexible board-level routing.
  • Industrial-Grade Operation: −40 °C to 100 °C operating range addresses typical industrial thermal environments.
  • Compact Surface-Mount Package: 208-pin BFQFP (28×28 PQFP) provides a balance of pin count and PCB footprint for dense designs.

Why Choose M1A3P1000-PQ208I?

The M1A3P1000-PQ208I positions itself as a practical choice for engineers needing a flash-configured FPGA with a strong mix of logic density, I/O resources, and on-chip memory within an industrial temperature envelope. Its flash-based ProASIC3/EL architecture provides non-volatile configuration while enabling low static power operation.

This device fits designs that require consolidation of discrete logic, flexible peripheral interfacing, and reliable operation across a broad temperature range. Its combination of programmable resources and package options supports scalable development and long-term deployment in industrial and embedded systems.

Request a quote or submit a sales inquiry for the M1A3P1000-PQ208I to receive pricing and availability information tailored to your project needs.

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