M1A3P1000-PQ208

IC FPGA 154 I/O 208QFP
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP

Quantity 485 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O154Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M1A3P1000-PQ208 – ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP

The M1A3P1000-PQ208 is a ProASIC3 family flash-based FPGA featuring low-power Flash*Freeze technology. It delivers a large logic fabric and on-chip embedded memory in a compact surface-mount 208-pin BFQFP package for commercial-grade designs.

With approximately 24,576 logic elements, about 147,456 bits of embedded RAM, and 154 I/O pins, this device targets embedded designs that require non-volatile configuration, significant programmable logic capacity, and a broad I/O complement while operating from a narrow core supply range.

Key Features

  • Core & Logic: Approximately 24,576 logic elements and roughly 1,000,000 gates provide substantial programmable logic capacity for custom functions and control logic.
  • Embedded Memory: Approximately 147,456 bits (~0.147 Mbits) of on-chip RAM for data buffering, state machines, and small lookup tables.
  • I/O Density: 154 dedicated I/O pins support flexible interfacing and peripheral connectivity.
  • Non-volatile Configuration: Flash-based architecture with Flash*Freeze technology for low-power configuration retention and predictable startup behavior.
  • Power Supply: Core voltage operation specified from 1.425 V to 1.575 V for controlled power budgeting and supply design.
  • Package & Mounting: 208-BFQFP (supplier device package 208-PQFP, 28 × 28) in a surface-mount form factor for compact PCB integration.
  • Operating Range: Commercial grade operating temperature range of 0 °C to 85 °C.
  • Compliance: RoHS compliant for environmental and regulatory alignment.

Typical Applications

  • Embedded Control Systems: Use the device’s 24,576 logic elements and on-chip RAM to implement custom control logic, finite state machines, and peripheral glue logic.
  • I/O Expansion and Interface Bridging: The 154 I/O pins allow consolidation of multiple interfaces and signal-level translation in compact system designs.
  • Low-Power FPGA Functions: Flash-based configuration with Flash*Freeze technology suits applications that require non-volatile configuration and controlled power profiles.

Unique Advantages

  • Flash Non-Volatile Configuration: Built-in flash configuration eliminates the need for external configuration memory while enabling instant-on behavior after power-up.
  • High Logic Density: Roughly 24,576 logic elements and ~1,000,000 gates enable complex custom logic without resorting to larger device families.
  • Compact Surface-Mount Package: The 208-BFQFP (208-PQFP, 28×28) provides a balance of pin count and PCB footprint for space-constrained designs.
  • Predictable Power Envelope: A clearly defined core voltage range (1.425–1.575 V) simplifies power-supply design and margining.
  • Commercial Temperature Support: Rated for 0 °C to 85 °C operation to match a wide range of commercial embedded applications.
  • RoHS Compliance: Meets RoHS requirements for lead-free assembly and regulatory alignment.

Why Choose M1A3P1000-PQ208?

The M1A3P1000-PQ208 positions itself as a flash-based, low-power FPGA option with significant on-chip logic and memory capacity in a rugged 208-pin BFQFP package. It is suited for designers who need non-volatile configuration, a substantial number of I/Os, and a well-defined electrical and thermal operating envelope for commercial embedded applications.

This device offers a balance of integration and predictability—making it appropriate for mid-complexity programmable logic implementations where on-board flash configuration, power control, and a compact package are priorities.

Request a quote or contact sales to discuss availability, lead times, and how the M1A3P1000-PQ208 can be integrated into your next design.

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