M1A3P1000-PQ208
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP |
|---|---|
| Quantity | 485 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 154 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M1A3P1000-PQ208 – ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP
The M1A3P1000-PQ208 is a ProASIC3 family flash-based FPGA featuring low-power Flash*Freeze technology. It delivers a large logic fabric and on-chip embedded memory in a compact surface-mount 208-pin BFQFP package for commercial-grade designs.
With approximately 24,576 logic elements, about 147,456 bits of embedded RAM, and 154 I/O pins, this device targets embedded designs that require non-volatile configuration, significant programmable logic capacity, and a broad I/O complement while operating from a narrow core supply range.
Key Features
- Core & Logic: Approximately 24,576 logic elements and roughly 1,000,000 gates provide substantial programmable logic capacity for custom functions and control logic.
- Embedded Memory: Approximately 147,456 bits (~0.147 Mbits) of on-chip RAM for data buffering, state machines, and small lookup tables.
- I/O Density: 154 dedicated I/O pins support flexible interfacing and peripheral connectivity.
- Non-volatile Configuration: Flash-based architecture with Flash*Freeze technology for low-power configuration retention and predictable startup behavior.
- Power Supply: Core voltage operation specified from 1.425 V to 1.575 V for controlled power budgeting and supply design.
- Package & Mounting: 208-BFQFP (supplier device package 208-PQFP, 28 × 28) in a surface-mount form factor for compact PCB integration.
- Operating Range: Commercial grade operating temperature range of 0 °C to 85 °C.
- Compliance: RoHS compliant for environmental and regulatory alignment.
Typical Applications
- Embedded Control Systems: Use the device’s 24,576 logic elements and on-chip RAM to implement custom control logic, finite state machines, and peripheral glue logic.
- I/O Expansion and Interface Bridging: The 154 I/O pins allow consolidation of multiple interfaces and signal-level translation in compact system designs.
- Low-Power FPGA Functions: Flash-based configuration with Flash*Freeze technology suits applications that require non-volatile configuration and controlled power profiles.
Unique Advantages
- Flash Non-Volatile Configuration: Built-in flash configuration eliminates the need for external configuration memory while enabling instant-on behavior after power-up.
- High Logic Density: Roughly 24,576 logic elements and ~1,000,000 gates enable complex custom logic without resorting to larger device families.
- Compact Surface-Mount Package: The 208-BFQFP (208-PQFP, 28×28) provides a balance of pin count and PCB footprint for space-constrained designs.
- Predictable Power Envelope: A clearly defined core voltage range (1.425–1.575 V) simplifies power-supply design and margining.
- Commercial Temperature Support: Rated for 0 °C to 85 °C operation to match a wide range of commercial embedded applications.
- RoHS Compliance: Meets RoHS requirements for lead-free assembly and regulatory alignment.
Why Choose M1A3P1000-PQ208?
The M1A3P1000-PQ208 positions itself as a flash-based, low-power FPGA option with significant on-chip logic and memory capacity in a rugged 208-pin BFQFP package. It is suited for designers who need non-volatile configuration, a substantial number of I/Os, and a well-defined electrical and thermal operating envelope for commercial embedded applications.
This device offers a balance of integration and predictability—making it appropriate for mid-complexity programmable logic implementations where on-board flash configuration, power control, and a compact package are priorities.
Request a quote or contact sales to discuss availability, lead times, and how the M1A3P1000-PQ208 can be integrated into your next design.

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