M1A3P1000-FGG256

The M1A3P1000-FGG256 is a ProASIC3 field programmable gate array (FPGA) packaged in a 256-LBGA (256-FPBGA, 17×17) surface-mount package. It delivers a high-density, nonvolatile flash-based FPGA fabric suited to commercial applications that require reprogrammable logic, a large I/O count, and compact board-level integration.

Built for use in consumer, portable and battery-backed markets, the device combines substantial logic and embedded memory resources with low-power silicon and secure in-system programming options, enabling fast development cycles and field updates without added nonvolatile components.

Key Features

• Logic Resources — 24,576 logic elements (reported as Number Of Logic Elements Cells) providing capacity for complex digital logic and control functions.
• Gate Equivalent — 1,000,000 system gates for sizing against target designs and migration from ASSP/ASIC solutions.
• Embedded Memory — Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) to support FIFOs, buffers and small data stores.
• High I/O Count — 177 user I/Os for extensive peripheral, sensor, and bus interfacing on a single device.
• Flash-Based, Reprogrammable Architecture — Nonvolatile flash configuration enables instant-on behavior and retains the programmed design when powered off.
• Security and ISP — Series-level support for in-system programming (ISP) with on-chip AES decryption and FlashLock designed to protect FPGA contents during updates.
• Power — Core supply range 1.425 V to 1.575 V (commercial-grade 1.5 V class) for low-power operation and compatibility with 1.5 V systems.
• Advanced I/O Capability — Supports mixed-voltage I/O operation across standard single-ended I/O levels to enable flexible board-level interfacing (series-level feature).
• Package and Mounting — 256-LBGA (256-FPBGA, 17×17) surface-mount package for compact PCB designs and high-density routing.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation for commercial applications.
• Regulatory — RoHS compliant.

Typical Applications

• Portable and Battery-Powered Devices — Low-voltage core and flash-based instant-on capability help minimize external components and extend battery life in handheld products.
• Consumer Electronics — High I/O count and substantial logic density enable user-interface control, peripheral aggregation, and custom signal processing in compact form factors.
• Secure In-System Upgrades — On-chip AES decryption and FlashLock support secure firmware and bitstream updates via JTAG, suitable for field-upgradeable products.
• Embedded Control and Glue Logic — Large logic element count and embedded RAM make the device a fit for replacing multiple discrete logic ICs or simplifying complex glue-logic implementations.

Unique Advantages

• Nonvolatile, Reprogrammable Flash — Eliminates the need for external configuration memory while enabling design updates and rapid deployment.
• High Integration — Combines up to 24,576 logic elements, ~0.147 Mbits of embedded RAM, and 177 I/Os in a single 256-LBGA package to reduce bill-of-materials and PCB area.
• Secure ISP — On-chip AES-based ISP and FlashLock capabilities protect intellectual property and support secure field updates.
• Low-Voltage Core — 1.425–1.575 V core supply supports low-power system architectures while maintaining performance headroom.
• Commercial Temperature Rating — Designed for 0 °C to 85 °C operation to meet typical commercial application requirements.
• RoHS Compliance and Surface-Mount Packaging — Facilitates modern manufacturing and regulatory requirements with a compact, board-friendly package.

Why Choose M1A3P1000-FGG256?

The M1A3P1000-FGG256 positions itself as a high-density, flash-based ProASIC3 FPGA targeted at commercial designs that need reprogrammable logic, secure in-system updates, and a large I/O complement in a compact package. Its combination of 24,576 logic elements, 177 I/Os, and on-chip memory enables consolidation of multiple functions onto a single device, simplifying board design and lowering overall system cost.

This device is suitable for engineering teams building consumer, portable, and other commercial products that require reliable, low-power operation with secure field programmability and a small PCB footprint. Its RoHS compliance, surface-mount 256-LBGA package, and 1.5 V-class core supply make it a practical choice for production designs requiring long-term availability and straightforward integration.

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