M1A3P1000-FGG484

The M1A3P1000-FGG484 is a ProASIC3-series FPGA from Microchip Technology delivering a single-chip, nonvolatile programmable logic solution for commercial embedded designs. It combines a high gate count and a large I/O complement with on-chip embedded memory and flash-based configuration to support control, glue-logic, and subsystem integration in consumer and portable applications.

With 24,576 logic elements and approximately 0.147 Mbits of embedded RAM, this surface-mount 484‑BGA device targets designs that require dense logic, flexible mixed-voltage I/O, and power-sensitive operation while retaining configured designs when power is removed.

Key Features

• Logic Capacity — 24,576 logic elements (cells) providing a substantial fabric for custom logic and control functions.
• Gate Count — 1,000,000 gates to support complex logic implementations and system-level integration.
• Embedded Memory — Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) for data buffering, FIFOs, and small on-chip storage.
• I/O Density & Flexibility — 300 user I/Os with support for mixed-voltage operation; bank-selectable I/O voltages enable interfacing with 1.5V, 1.8V, 2.5V and 3.3V domains.
• Configuration & Security — Flash-based, reprogrammable configuration retains programmed designs without power; series documentation cites support for secure in-system programming using on-chip AES decryption via JTAG.
• Power Supply — Core supply range specified at 1.425 V to 1.575 V to meet the device’s core power requirements.
• Package & Mounting — 484‑BGA (484‑FPBGA, 23 × 23) surface-mount package for compact board-level integration and high pin density.
• Operating Temperature — Commercial grade, specified for 0 °C to 85 °C operation to match typical commercial embedded environments.
• Clocking & Performance — Series documentation reports high-performance routing and clock conditioning circuitry with documented system performance up to 350 MHz in ProASIC3 nano devices.
• RoHS Compliance — Device is RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• Consumer Electronics — Implement user interfaces, peripheral glue logic, and protocol bridging in compact handheld and portable products where footprint and instant-on behavior matter.
• Embedded Control — Replace multiple discrete logic components with a single FPGA for motor control front-ends, sensor aggregation, or local decision-making functions.
• Connectivity & Interface Bridging — Use the large I/O count and mixed-voltage support for level translation and interface adaptation between different subsystems.
• Battery-Powered Systems — Leverage flash-based, instant-on configuration and low-power characteristics cited for ProASIC3 devices to reduce power-up sequences and retain configuration without external nonvolatile memory.

Unique Advantages

• High Logic Density: 24,576 logic elements and 1,000,000 gates enable consolidation of complex functions into a single device, reducing board BOM and component count.
• Flexible I/O Integration: 300 user I/Os with bank-selectable voltages simplify mixed-voltage system interfacing and lower the need for external level-shifting components.
• Nonvolatile, Reprogrammable Configuration: Flash-based configuration retains the programmed design when powered off and supports in-system updates, improving maintainability and field upgrades.
• Compact, High-Pin-Count Package: 484‑BGA (23 × 23) packaging provides high I/O density in a compact footprint for space-constrained boards.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to meet the needs of commercial embedded applications.
• Microchip Backing: Part of the ProASIC3 family from Microchip Technology, benefiting from documented device features and ecosystem resources.

Why Choose M1A3P1000-FGG484?

The M1A3P1000-FGG484 positions itself as a high-capacity, flexible FPGA for commercial embedded designs that demand significant logic resources, a large number of I/Os, and nonvolatile configuration. Its combination of 24,576 logic elements, approximately 0.147 Mbits of embedded RAM, and secure flash-based configuration makes it well suited for consolidating control, interface, and buffering functions into a single package.

Designed for compact board layouts with its 484‑BGA package and supporting mixed-voltage I/O, this device helps reduce external components and simplifies system-level integration, delivering long-term value through reprogrammability and support from Microchip’s ProASIC3 family documentation.

Request a quote or submit an inquiry to obtain pricing and availability for M1A3P1000-FGG484. Our team can provide lead-time and ordering information to help move your design forward.