M1A3P1000-FGG144I

The M1A3P1000-FGG144I is a ProASIC3 flash-based FPGA offering a high-density logic fabric with nonvolatile, reprogrammable configuration memory. It combines a large number of logic elements and substantial embedded RAM with advanced I/O flexibility and security features, making it suitable for industrial and portable applications where low power, instant-on behavior, and design security matter.

This device targets designs that require a compact, surface-mount FPGA package with industrial temperature operation, mixed-voltage I/O support, and on-chip features that simplify system integration.

Key Features

• Logic Capacity  24,576 logic elements (cells) and approximately 1,000,000 equivalent gates provide substantial combinational and sequential logic resources for medium- to high-density designs.
• Embedded Memory  Approximately 0.147 Mbits of on-chip RAM (147,456 total RAM bits) to implement SRAM, FIFOs, and buffering without external memory.
• High I/O Flexibility  97 user I/Os with mixed-voltage support (1.5 V, 1.8 V, 2.5 V and 3.3 V) and bank-selectable I/O voltages for easy interfacing with a variety of peripherals and power rails.
• Nonvolatile Flash Configuration  Flash-based reprogrammable architecture that retains the programmed design when powered off, enabling instant-on single-chip solutions.
• Security and In-System Programming (ISP)  On-chip 128-bit AES decryption for secure ISP via JTAG and FlashLock® technology to protect bitstream contents.
• Clocking and Timing  Clock conditioning circuitry with up to six CCC blocks, including an integrated PLL, for flexible clock generation, phase shift and frequency multiplication/division.
• Performance and Low Power  Series-level support for low-power operation and system performance up to 350 MHz (as specified for the ProASIC3 family), with a low-voltage core supply range of 1.425 V to 1.575 V.
• Package and Mechanical  144-LBGA surface-mount package (supplier device package: 144-FPBGA, 13 × 13 mm) for compact board integration and reliable soldered mounting.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Standards and I/O Options  Single-ended I/O standards supported (LVTTL, LVCMOS 3.3 V/2.5 V/1.8 V/1.5 V), I/O registers on input/output/enable paths, selectable Schmitt trigger inputs, programmable output slew and drive strength, and hot-swap capable I/Os.
• Regulatory  RoHS-compliant.

Typical Applications

• Industrial Control  Implement control logic, I/O aggregation, and protocol bridging in industrial systems—leveraging the device’s 97 I/Os, industrial temperature rating, and compact LBGA package.
• Portable and Battery-Backed Devices  Use the instant-on, low-power flash architecture for consumer and portable designs that require quick startup and retained configuration without external memory.
• Secure Embedded Systems  Deploy secure in-system programming and FlashLock protection for designs that require encrypted updates and bitstream protection.
• Mixed-Voltage Interface Hubs  Serve as a flexible interface or glue logic device between 1.5 V core domains and 2.5/3.3 V peripheral domains using bank-selectable I/O voltages.

Unique Advantages

• Nonvolatile, Reprogrammable Flash: Retains design when power is removed, enabling instant-on behavior and removing the need for external configuration memory.
• Integrated Security for ISP: Built-in 128-bit AES decryption via JTAG and FlashLock protection help secure firmware updates and prevent unauthorized bitstream access.
• Wide I/O Flexibility: 97 user I/Os with support for multiple voltage standards and programmable drive characteristics simplify mixed-voltage system integration.
• Compact Industrial Package: 144-LBGA (13 × 13 mm) surface-mount package provides a dense, PCB-friendly option for space-constrained designs operating over −40 °C to 100 °C.
• On-Chip Clock Conditioning: Multiple CCC blocks and an integrated PLL give designers flexible clocking options without extensive external components.
• Significant Logic and Memory Resources: Large logic element count and approximately 0.147 Mbits of on-chip RAM reduce reliance on external logic and memory, lowering BOM and simplifying board design.

Why Choose M1A3P1000-FGG144I?

The M1A3P1000-FGG144I positions itself as a robust, industrial-grade FPGA that blends nonvolatile flash configuration, high logic count, and flexible I/O in a compact 144-LBGA package. Its combination of logic capacity, embedded RAM, secure ISP features, and wide operating temperature range makes it a practical choice for engineers building industrial controls, portable systems, and mixed-voltage interfaces that demand dependable power-off retention and configuration security.

This device delivers long-term value through reduced system complexity (fewer external components for configuration and clocking), flexible interfacing, and on-chip security—making it well suited for teams focused on reliable deployments and streamlined BOMs.

Request a quote or submit a sales inquiry to get pricing and availability for the M1A3P1000-FGG144I and to discuss how it fits your next design.