M1A3P1000-FG484
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA |
|---|---|
| Quantity | 1,149 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 300 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M1A3P1000-FG484 – ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA
The M1A3P1000-FG484 is a ProASIC3 family flash-based FPGA from Microchip Technology in a 484-BGA surface-mount package. It delivers a balance of logic capacity, on-chip memory, and I/O density for programmable logic designs.
Built on the ProASIC3 low-power flash architecture (including Flash*Freeze technology referenced in the family datasheet), this device provides 24,576 logic elements, approximately 147,456 bits of embedded RAM, and 300 user I/O pins for flexible system integration.
Key Features
- Core Architecture ProASIC3 flash-based low-power FPGA architecture with Flash*Freeze technology as described in the family datasheet.
- Logic Capacity 24,576 logic elements (24576) and approximately 1,000,000 logic gates to implement medium-density designs.
- Embedded Memory 147,456 total RAM bits — approximately 0.147 Mbits of on-chip memory for buffering and state storage.
- I/O Resources 300 user I/O pins to support multi-channel interfaces and broad connectivity requirements.
- Power Single-core supply voltage range: 1.425 V to 1.575 V for core power budgeting and supply design.
- Package & Mounting 484-FPBGA (23 × 23 mm) package case (484-BGA), surface-mount mounting for high-density board integration.
- Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Communications — Use for custom packet processing, interface bridging or protocol adaptation leveraging the device’s 300 I/Os and substantial logic capacity.
- Data Acceleration & Offload — Implement custom data-path logic and buffering using the available logic elements and on-chip RAM.
- Embedded System Integration — System-level glue logic, peripheral control, and custom finite-state machines where moderate logic density and flexible I/O are required.
Unique Advantages
- Flash-based, low-power architecture: Flash configuration enables non-volatile, quick power-up behavior consistent with the ProASIC3 family characteristics.
- Balanced logic and memory: 24,576 logic elements combined with 147,456 bits of RAM provide capacity for control, signal processing, and buffering in a single device.
- High I/O count in a compact package: 300 user I/Os in a 484-FPBGA (23×23) package supports dense system designs without excessive board area.
- Commercial temperature and RoHS compliance: Commercial-grade operating range (0 °C to 85 °C) and RoHS compliance ease integration into mainstream electronic products.
- Predictable core supply window: Narrow core voltage range (1.425 V–1.575 V) helps simplify core power supply design.
Why Choose M1A3P1000-FG484?
The M1A3P1000-FG484 positions itself as a flash-based FPGA option for designers needing a practical balance of logic density, embedded memory, and I/O connectivity in a compact 484-BGA package. With the ProASIC3 family heritage and Flash*Freeze technology referenced in the datasheet, it supports low-power, non-volatile programmable logic implementations.
Engineers targeting communications, data-processing, or embedded system roles will find the device’s combination of 24,576 logic elements, roughly 0.147 Mbits of embedded RAM, 300 I/Os, and a defined supply and temperature envelope suitable for commercial designs that require predictable, flash-configured FPGA behavior.
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