M1A3P1000-FG484

IC FPGA 300 I/O 484FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA

Quantity 1,149 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O300Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M1A3P1000-FG484 – ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA

The M1A3P1000-FG484 is a ProASIC3 family flash-based FPGA from Microchip Technology in a 484-BGA surface-mount package. It delivers a balance of logic capacity, on-chip memory, and I/O density for programmable logic designs.

Built on the ProASIC3 low-power flash architecture (including Flash*Freeze technology referenced in the family datasheet), this device provides 24,576 logic elements, approximately 147,456 bits of embedded RAM, and 300 user I/O pins for flexible system integration.

Key Features

  • Core Architecture ProASIC3 flash-based low-power FPGA architecture with Flash*Freeze technology as described in the family datasheet.
  • Logic Capacity 24,576 logic elements (24576) and approximately 1,000,000 logic gates to implement medium-density designs.
  • Embedded Memory 147,456 total RAM bits — approximately 0.147 Mbits of on-chip memory for buffering and state storage.
  • I/O Resources 300 user I/O pins to support multi-channel interfaces and broad connectivity requirements.
  • Power Single-core supply voltage range: 1.425 V to 1.575 V for core power budgeting and supply design.
  • Package & Mounting 484-FPBGA (23 × 23 mm) package case (484-BGA), surface-mount mounting for high-density board integration.
  • Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Communications — Use for custom packet processing, interface bridging or protocol adaptation leveraging the device’s 300 I/Os and substantial logic capacity.
  • Data Acceleration & Offload — Implement custom data-path logic and buffering using the available logic elements and on-chip RAM.
  • Embedded System Integration — System-level glue logic, peripheral control, and custom finite-state machines where moderate logic density and flexible I/O are required.

Unique Advantages

  • Flash-based, low-power architecture: Flash configuration enables non-volatile, quick power-up behavior consistent with the ProASIC3 family characteristics.
  • Balanced logic and memory: 24,576 logic elements combined with 147,456 bits of RAM provide capacity for control, signal processing, and buffering in a single device.
  • High I/O count in a compact package: 300 user I/Os in a 484-FPBGA (23×23) package supports dense system designs without excessive board area.
  • Commercial temperature and RoHS compliance: Commercial-grade operating range (0 °C to 85 °C) and RoHS compliance ease integration into mainstream electronic products.
  • Predictable core supply window: Narrow core voltage range (1.425 V–1.575 V) helps simplify core power supply design.

Why Choose M1A3P1000-FG484?

The M1A3P1000-FG484 positions itself as a flash-based FPGA option for designers needing a practical balance of logic density, embedded memory, and I/O connectivity in a compact 484-BGA package. With the ProASIC3 family heritage and Flash*Freeze technology referenced in the datasheet, it supports low-power, non-volatile programmable logic implementations.

Engineers targeting communications, data-processing, or embedded system roles will find the device’s combination of 24,576 logic elements, roughly 0.147 Mbits of embedded RAM, 300 I/Os, and a defined supply and temperature envelope suitable for commercial designs that require predictable, flash-configured FPGA behavior.

Request a quote or submit a sales inquiry to check pricing and availability for the M1A3P1000-FG484. Provide your requirements to receive tailored purchasing information and lead-time details.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up