M1A3P1000-FG144M

The M1A3P1000-FG144M is a ProASIC3 field programmable gate array (FPGA) device designed for demanding, qualification-driven applications. It provides a balance of dense logic resources, embedded memory, and a compact 144-ball BGA package suitable for surface-mount assembly.

With military-grade qualification to MIL-STD-883 and an extended operating range, this FPGA targets systems that require robust performance across extreme temperatures while offering a defined I/O count and on-chip memory for mid-density logic designs.

Key Features

• Logic Capacity – 24,576 logic elements (cells) corresponding to approximately 1,000,000 gates to support complex combinational and sequential logic.
• Embedded Memory – 147,456 total RAM bits, approximately 0.15 Mbits of embedded memory for on-chip data storage and buffering.
• I/O Count – 97 user I/Os to interface with external peripherals, sensors, and system buses.
• Package and Mounting – 144-LBGA package (supplier device package: 144-FPBGA 13×13) in a surface-mount form factor for compact board layouts.
• Power Supply – Specified operating supply range of 1.425 V to 1.575 V to match system power rails.
• Environmental and Qualification – Military grade with qualification to MIL-STD-883 and an operating temperature range of -55°C to 125°C for harsh-environment deployment.

Typical Applications

• Military and Defense Systems – Suited for rugged, qualification-driven modules where MIL-STD-883 compliance and wide temperature operation are required.
• Harsh-Environment Embedded Electronics – Use in control and processing nodes that must operate reliably from −55°C to 125°C.
• Mid-Density Logic Integration – Integration of glue logic, protocol conversion, and moderate on-chip memory buffering in space-constrained designs.

Unique Advantages

• Military-Grade Qualification: MIL-STD-883 qualification delivers a documented level of reliability and traceability for defense programs.
• Extended Temperature Range: Rated for −55°C to 125°C to maintain functionality across extreme thermal environments.
• High Logic Density: 24,576 logic elements and approximately 1,000,000 gates enable implementation of substantial custom logic within a single device.
• On-Chip Memory: Approximately 0.15 Mbits of embedded RAM reduces the need for external memory for buffering and state storage.
• Compact BGA Package: 144-ball LBGA / 144-FPBGA (13×13) allows dense PCB routing while supporting surface-mount assembly processes.
• Defined I/O Count: 97 I/Os provide a predictable interface footprint for system integration.

Why Choose M1A3P1000-FG144M?

The M1A3P1000-FG144M combines substantial on-chip logic and memory with military-grade qualification and an extended operating temperature window, making it a strong choice for designers of mission-critical and rugged embedded systems. Its compact 144-ball BGA package and 97 I/Os simplify board-level integration while delivering enough capacity for mid-density logic implementations.

This device is well suited to customers who require a qualified, reliable FPGA platform with clear electrical and environmental specifications. Its combination of logic resources, embedded memory, and qualification supports lifecycle-driven procurement and long-term deployment in harsh environments.

Request a quote or contact sales to receive pricing, availability, and assistance integrating the M1A3P1000-FG144M into your next design.