M1A3P1000-FG144I

The M1A3P1000-FG144I is a ProASIC3/EL flash-based field programmable gate array (FPGA) offered in a compact 144-LBGA package. It combines a high count of logic elements and on-chip RAM with flash technology and Flash*Freeze features described for the ProASIC3/EL family.

Designed for industrial-grade embedded applications, the device provides a balance of logic density, I/O flexibility and robust operating range, making it suitable for control, interface and system integration tasks where reprogrammability and low-power flash architecture are required.

Key Features

• Core Architecture  ProASIC3/EL flash-based FPGA architecture with Flash*Freeze Technology as described in the device family documentation.
• Logic Capacity  24,576 logic elements (listed as logic element cells) supporting designs up to approximately 1,000,000 gates.
• Embedded Memory  147,456 bits of total on-chip RAM — approximately 0.15 Mbits of embedded memory for data buffering and state storage.
• I/O Resources  97 user I/Os for interfacing to peripherals, sensors and external devices.
• Power  Nominal core supply voltage range of 1.425 V to 1.575 V to support the device’s flash FPGA core.
• Package & Mounting  144-LBGA (supplier package: 144-FPBGA, 13 × 13 mm) in a surface-mount format for compact board designs.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Gate-level customization, I/O aggregation and control logic for factory automation, motor control interfaces and PLC adjuncts, leveraging the industrial temperature rating and 97 I/Os.
• Embedded System Integration  Custom glue logic, protocol bridging and peripheral consolidation in compact embedded products where on-chip flash-based reconfiguration and a 13 × 13 mm LBGA package help reduce board area.
• Communications & Networking Equipment  Implementation of control and interfacing functions or low-to-medium density packet processing tasks using the device’s logic elements and embedded RAM.

Unique Advantages

• Flash-based, non-volatile FPGA architecture  Flash technology enables a programmable FPGA that leverages the ProASIC3/EL family’s flash features and Flash*Freeze capabilities.
• High logic density for compact designs  24,576 logic elements and roughly 1,000,000 gates provide the resources to integrate significant custom logic without external CPLDs or ASICs.
• Embedded RAM for on-chip buffering  Approximately 0.15 Mbits of on-chip RAM offers space for FIFOs, small tables and state memory, reducing reliance on external memory for many control functions.
• Wide industrial operating range  −40 °C to 100 °C rating supports deployment in industrial environments with broader temperature swings.
• Space-efficient LBGA packaging  144-LBGA (13 × 13 mm FPBGA) and surface-mount compatibility simplify placement in small, densely populated PCBs.
• Regulatory and supply considerations  RoHS compliance supports environmentally conscious manufacturing and end-product compliance efforts.

Why Choose M1A3P1000-FG144I?

The M1A3P1000-FG144I is positioned for embedded and industrial applications that need a reprogrammable, flash-based FPGA with substantial logic capacity and on-chip memory in a compact surface-mount package. Its combination of 24,576 logic elements, approximately 0.15 Mbits of embedded RAM and 97 I/Os addresses mid-range logic integration and interface consolidation on space-constrained boards.

This device suits designers seeking a flash FPGA solution with industrial temperature capability and a small LBGA footprint, offering a balance of integration, programmability and deployment robustness for production-grade embedded systems.

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