M1A3P1000-FG256I

The M1A3P1000-FG256I is a ProASIC3 flash-based FPGA offering a balance of logic capacity, embedded memory and I/O density for industrial designs. It is built on Microsemi's low-power flash FPGA architecture and references the series' Flash*Freeze technology for reduced power modes.

This device provides 24,576 logic elements, approximately 0.15 Mbits of on-chip RAM, and 177 user I/Os in a compact 256-LBGA package, making it suitable for systems that require a mid-range FPGA with industrial temperature capability.

Key Features

• Core Logic 24,576 logic elements delivering around 1,000,000 equivalent gates for implementing medium-complexity digital functions.
• Embedded Memory Approximately 0.15 Mbits of on-chip RAM (147,456 total RAM bits) for buffering, FIFOs and small data stores.
• I/O Density 177 user I/Os to support multiple peripheral interfaces and board-level connectivity without external multiplexing.
• Low-Power Flash Architecture Flash-based configuration with Flash*Freeze technology for reduced power consumption and non-volatile configuration retention.
• Power Supply Narrow core supply range of 1.425 V to 1.575 V for predictable power budgeting and regulator selection.
• Package & Mounting 256-LBGA package (supplier package: 256-FPBGA, 17×17) optimized for surface-mount assembly and compact board layouts.
• Industrial Temperature Grade Qualified for operation from −40°C to 100°C to meet industrial environmental requirements.
• Regulatory RoHS compliant.

Typical Applications

• Aerospace & Defense — Flash-based, low-power FPGA capability supports configurability and field updates referenced in the series documentation.
• Communications — I/O density and embedded memory make the device suitable for protocol bridging, control planes and interface aggregation functions.
• Data Center — Useful for control, management or custom logic offload where non-volatile configuration and power management are important.
• Industrial Systems — Industrial temperature rating and robust I/O count support automation, motor control logic and sensor aggregation in harsh environments.

Unique Advantages

• Significant Logic Capacity: 24,576 logic elements and ~1,000,000 gates provide headroom for medium-complexity designs without external logic.
• On-chip Memory for Real-Time Tasks: Approximately 0.15 Mbits of embedded RAM supports buffering and low-latency data paths.
• Flash-based Non-Volatile Configuration: Flash configuration retains designs without external configuration memory and enables low-power standby using Flash*Freeze.
• Compact, Surface-Mount Package: 256-LBGA (17×17 FPBGA) balances pin count and board area for space-constrained systems.
• Industrial Temperature Range: −40°C to 100°C operation extends suitability across a wide range of deployed environments.
• Tight Core Voltage Window: Defined 1.425–1.575 V supply simplifies power-supply design and thermal/power budgeting.

Why Choose M1A3P1000-FG256I?

The M1A3P1000-FG256I positions itself as a mid-capacity, flash-configured FPGA that combines substantial logic and I/O resources with on-chip RAM and low-power flash technology. Its industrial temperature rating and compact 256-LBGA package make it well suited to applications that require non-volatile configuration, reliable operation across temperature extremes, and moderate integration of digital logic and interfaces.

Designers looking for a field-programmable, flash-based device with clear power supply requirements, RoHS compliance, and a balance of logic, memory and I/O will find the M1A3P1000-FG256I appropriate for deployment in industrial, communications, aerospace & defense and data center environments referenced in the product series documentation.

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