M1A3P1000-FG484I

IC FPGA 300 I/O 484FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA

Quantity 212 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O300Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M1A3P1000-FG484I – ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA

The M1A3P1000-FG484I is a ProASIC3-series flash-based FPGA from Microchip Technology, designed for industrial applications requiring mid-range logic capacity and embedded memory. It belongs to the ProASIC3/EL family as documented in the supplier datasheet and incorporates family-level low-power features.

This device delivers a balanced combination of logic density, I/O capacity and on-chip RAM, packaged in a 484-ball BGA suitable for surface-mount assembly and operation across an extended industrial temperature range.

Key Features

  • Core Logic — 24,576 logic elements (reported as Number Of Labs Clbs / Number Of Logic Elements Cells) with a gate equivalent of 1,000,000 to implement mid-scale digital designs.
  • Embedded Memory — 147,456 total RAM bits (approximately 0.147 Mbits) of on-chip memory for buffering, FIFOs and small embedded storage needs.
  • I/O Capability — 300 user I/O pins to support a wide range of external interfaces and parallel/peripheral connections.
  • Power — Single core supply range specified at 1.425 V to 1.575 V for logic power budgeting and domain planning.
  • Package & Mounting — 484-BGA (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board-level integration.
  • Temperature Range — Industrial operating temperature from −40 °C to 100 °C for deployment in harsh environments.
  • Low-Power Family Technology — Part of the ProASIC3/EL low-power flash FPGA family; documented family-level features include Flash*Freeze technology for reduced power modes.
  • Compliance — RoHS compliant to support regulatory and green-design requirements.

Typical Applications

  • Aerospace & Defense — Suitable for system logic, glue-logic and mission electronics where flash-based FPGA solutions are preferred, as referenced in supplier family documentation.
  • Communications — Useful for protocol bridging, interface adaptation and custom packet processing within communication equipment.
  • Data Center & Storage — Applicable to control, timing and interface tasks in data center and storage system designs that require reprogrammable logic.
  • Industrial Systems — Appropriate for industrial control, instrumentation and I/O aggregation where industrial temperature support and robust packaging are required.

Unique Advantages

  • High logic integration: 24,576 logic elements and 1,000,000 gate equivalents enable consolidation of multiple functions into a single FPGA to reduce BOM and board area.
  • Generous I/O count: 300 user I/Os provide flexibility for interfacing with peripherals, sensors and high-density connectors.
  • Embedded memory for on-chip buffering: Approximately 0.147 Mbits of RAM supports local data storage and latency-sensitive buffering without external memory.
  • Industrial temperature support: Rated for −40 °C to 100 °C to meet extended-environment deployment requirements.
  • Compact BGA packaging: 484-BGA (23×23 FPBGA) offers a small footprint for space-constrained PCBs while supporting surface-mount assembly.
  • Flash-based, low-power family: As part of the ProASIC3/EL flash FPGA family with Flash*Freeze technology, the device aligns with designs that prioritize non-volatile configuration and reduced standby power at the family level.

Why Choose M1A3P1000-FG484I?

The M1A3P1000-FG484I combines mid-range logic capacity, a substantial I/O complement and embedded RAM in a robust industrial-temperature BGA package. Its flash-based ProASIC3 family heritage and documented family-level low-power features provide a practical balance of reprogrammability and power management for embedded system designs across aerospace, communications, data center and industrial markets.

Engineers and procurement teams seeking a flash-configured FPGA with defined operating voltage, ample I/O and on-chip memory will find this part suitable for consolidating logic, simplifying board design and supporting long-term deployments where industrial temperature range and RoHS compliance are required.

Request a quote or submit a purchase inquiry today to check availability and pricing for the M1A3P1000-FG484I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up