M1A3P1000-FG484I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA |
|---|---|
| Quantity | 212 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 300 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M1A3P1000-FG484I – ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA
The M1A3P1000-FG484I is a ProASIC3-series flash-based FPGA from Microchip Technology, designed for industrial applications requiring mid-range logic capacity and embedded memory. It belongs to the ProASIC3/EL family as documented in the supplier datasheet and incorporates family-level low-power features.
This device delivers a balanced combination of logic density, I/O capacity and on-chip RAM, packaged in a 484-ball BGA suitable for surface-mount assembly and operation across an extended industrial temperature range.
Key Features
- Core Logic — 24,576 logic elements (reported as Number Of Labs Clbs / Number Of Logic Elements Cells) with a gate equivalent of 1,000,000 to implement mid-scale digital designs.
- Embedded Memory — 147,456 total RAM bits (approximately 0.147 Mbits) of on-chip memory for buffering, FIFOs and small embedded storage needs.
- I/O Capability — 300 user I/O pins to support a wide range of external interfaces and parallel/peripheral connections.
- Power — Single core supply range specified at 1.425 V to 1.575 V for logic power budgeting and domain planning.
- Package & Mounting — 484-BGA (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board-level integration.
- Temperature Range — Industrial operating temperature from −40 °C to 100 °C for deployment in harsh environments.
- Low-Power Family Technology — Part of the ProASIC3/EL low-power flash FPGA family; documented family-level features include Flash*Freeze technology for reduced power modes.
- Compliance — RoHS compliant to support regulatory and green-design requirements.
Typical Applications
- Aerospace & Defense — Suitable for system logic, glue-logic and mission electronics where flash-based FPGA solutions are preferred, as referenced in supplier family documentation.
- Communications — Useful for protocol bridging, interface adaptation and custom packet processing within communication equipment.
- Data Center & Storage — Applicable to control, timing and interface tasks in data center and storage system designs that require reprogrammable logic.
- Industrial Systems — Appropriate for industrial control, instrumentation and I/O aggregation where industrial temperature support and robust packaging are required.
Unique Advantages
- High logic integration: 24,576 logic elements and 1,000,000 gate equivalents enable consolidation of multiple functions into a single FPGA to reduce BOM and board area.
- Generous I/O count: 300 user I/Os provide flexibility for interfacing with peripherals, sensors and high-density connectors.
- Embedded memory for on-chip buffering: Approximately 0.147 Mbits of RAM supports local data storage and latency-sensitive buffering without external memory.
- Industrial temperature support: Rated for −40 °C to 100 °C to meet extended-environment deployment requirements.
- Compact BGA packaging: 484-BGA (23×23 FPBGA) offers a small footprint for space-constrained PCBs while supporting surface-mount assembly.
- Flash-based, low-power family: As part of the ProASIC3/EL flash FPGA family with Flash*Freeze technology, the device aligns with designs that prioritize non-volatile configuration and reduced standby power at the family level.
Why Choose M1A3P1000-FG484I?
The M1A3P1000-FG484I combines mid-range logic capacity, a substantial I/O complement and embedded RAM in a robust industrial-temperature BGA package. Its flash-based ProASIC3 family heritage and documented family-level low-power features provide a practical balance of reprogrammability and power management for embedded system designs across aerospace, communications, data center and industrial markets.
Engineers and procurement teams seeking a flash-configured FPGA with defined operating voltage, ample I/O and on-chip memory will find this part suitable for consolidating logic, simplifying board design and supporting long-term deployments where industrial temperature range and RoHS compliance are required.
Request a quote or submit a purchase inquiry today to check availability and pricing for the M1A3P1000-FG484I.

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