M1A3P1000-FGG144M

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA

Quantity 365 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A001A2CHTS Code8542.39.0001
QualificationMIL-STD-883Total RAM Bits147456

Overview of M1A3P1000-FGG144M – ProASIC3 Field Programmable Gate Array (FPGA), 97 I/O, 144-LBGA

The M1A3P1000-FGG144M is a ProASIC3 Field Programmable Gate Array (FPGA) IC designed for applications requiring programmable logic with military-grade qualification. It provides a balance of programmable logic capacity, embedded on-chip memory and I/O availability in a compact 144-LBGA package.

Qualified to MIL-STD-883 and rated for operation from -55 °C to 125 °C, this device is targeted at systems where extended temperature range and formal military qualification are required. Electrical operation is specified for a core supply of 1.425 V to 1.575 V, and the device is RoHS compliant.

Key Features

  • Core Logic 24,576 logic elements provide programmable resources suitable for medium-complexity custom logic implementations and system glue logic.
  • Gates Approximately 1,000,000 gates of logic capacity to support a wide variety of user-defined digital functions.
  • Embedded Memory Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for buffering, state storage, and small data tables.
  • I/O Count 97 user I/O pins to interface with peripherals, sensors, and other system components.
  • Package and Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for compact board-level integration.
  • Electrical Core supply voltage range specified at 1.425 V to 1.575 V for predictable power design.
  • Temperature Range Operating rating from -55 °C to 125 °C to meet high-reliability and military temperature requirements.
  • Qualification & Compliance Military grade with MIL-STD-883 qualification and RoHS compliance for regulatory conformance.

Typical Applications

  • Military and Defense Systems MIL-STD-883 qualification and wide operating temperature range make this FPGA suitable for mission-critical defense electronics and secure communications logic.
  • Harsh-Environment Embedded Systems The extended -55 °C to 125 °C rating supports embedded controls and processing in environments with extreme temperatures.
  • Custom Logic and Interface Bridging With 24,576 logic elements and 97 I/O, the device is appropriate for implementing protocol bridging, sensor interfaces, and bespoke control logic.

Unique Advantages

  • Military Qualification: MIL-STD-883 qualification provides documented reliability and traceability for defense and high-reliability programs.
  • Wide Operating Temperature: Rated from -55 °C to 125 °C to support designs that must operate across extreme thermal environments.
  • Balanced Integration: A combination of 24,576 logic elements, approximately 0.147 Mbits of on-chip RAM, and 97 I/O delivers flexible resources without large board-area impact.
  • Compact BGA Packaging: 144-LBGA / 144-FPBGA (13×13) reduces footprint while providing sufficient I/O for typical embedded applications.
  • Regulatory Compliance: RoHS compliance supports environmental and supply-chain requirements.

Why Choose M1A3P1000-FGG144M?

The M1A3P1000-FGG144M positions itself as a military-qualified FPGA option that combines a substantial logic element count with on-chip memory and a practical I/O complement in a compact BGA package. Its MIL-STD-883 qualification and wide temperature rating make it well suited for designs where formal military qualification and thermal resilience are required.

This device is appropriate for engineers and program managers specifying programmable logic for high-reliability embedded systems, defense electronics, and other applications where qualification and environmental margins matter. Its technical profile supports scalability within designs that require medium-density logic, modest embedded memory, and a disciplined supply-voltage requirement.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the M1A3P1000-FGG144M. Our team can provide lead-time estimates and support for quantity and sourcing requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up