M1A3P1000-FG144

The M1A3P1000-FG144 is a ProASIC3 family flash-based field programmable gate array (FPGA) IC designed for compact, low-power logic integration. The device provides a balance of logic density, embedded memory, and I/O capability, making it suitable for mid-range programmable logic tasks in commercial embedded designs.

Key architectural attributes include a flash-based low-power FPGA core with Flash*Freeze technology, approximately 24,576 logic elements, roughly 0.147 Mbits of on-chip RAM, and 97 user I/Os, all delivered in a 144-LBGA surface-mount package.

Key Features

• Core Architecture Flash-based ProASIC3 FPGA family device with Flash*Freeze technology for low-power operation.
• Logic Capacity Approximately 24,576 logic elements (cells) and about 1,000,000 equivalent gates for mid-range logic integration.
• Embedded Memory Approximately 0.147 Mbits (147,456 bits) of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Resources 97 user I/Os to support multiple interfaces and peripheral connections in a compact form factor.
• Power Supply Narrow core voltage range: 1.425 V to 1.575 V to support stable core operation in controlled power environments.
• Package & Mounting 144-LBGA surface-mount package (supplier package: 144-FPBGA, 13×13) for space-efficient PCB integration.
• Temperature & Grade Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• Embedded System Control Implement custom control logic and state machines using the device’s 24,576 logic elements and on-chip RAM.
• Interface Bridging and Protocol Conversion Use the 97 I/Os to connect disparate peripherals and implement protocol translation in a single-package FPGA.
• Data Buffering and Local Processing Leverage approximately 0.147 Mbits of embedded memory for packet buffering, small FIFOs, and temporary storage in data-path designs.

Unique Advantages

• Flash-based, Low-Power Architecture: Flash*Freeze technology and a flash FPGA core provide low-power, non-volatile configuration that simplifies power-up behavior and in-field updates.
• Substantial Logic Density: Approximately 24,576 logic elements and ~1,000,000 gates allow consolidation of multiple logic functions into a single device, reducing board-level complexity.
• Balanced Memory and I/O: The combination of embedded RAM and 97 I/Os supports mixed control and data-processing tasks without immediate need for external memory or IO expanders.
• Compact Surface-Mount Package: The 144-LBGA (144-FPBGA, 13×13) package minimizes PCB footprint while delivering significant capability for space-constrained designs.
• Commercial Range Operating Conditions: Designed for commercial applications with a 0 °C to 85 °C operating range and a tightly specified core supply voltage for predictable integration.
• RoHS Compliance: Environmentally compliant manufacturing for global commercial product deployments.

Why Choose M1A3P1000-FG144?

The M1A3P1000-FG144 positions itself as a practical choice for designers seeking a flash-based, low-power FPGA that packs substantial logic and memory into a compact LBGA package. Its combination of roughly 24,576 logic elements, about 0.147 Mbits of embedded RAM, and 97 I/Os enables consolidation of control, interface, and buffering functions onto a single device for streamlined BOM and board area.

This part suits commercial embedded and communication applications where predictable supply requirements (1.425 V to 1.575 V), surface-mount integration, and RoHS compliance are important. The ProASIC3 family heritage and Flash*Freeze capability provide a low-power, non-volatile FPGA option for designs that require reliable configuration retention and in-field flexibility.

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