M1A3P1000-2PQG208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP |
|---|---|
| Quantity | 1,207 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 154 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M1A3P1000-2PQG208I – ProASIC3 Field Programmable Gate Array (FPGA) IC, 154 I/Os, 147,456-bit RAM, 208-BFQFP
The M1A3P1000-2PQG208I is a ProASIC3 flash-based FPGA from Microchip Technology designed as a secure, low-power, instant-on, single-chip programmable logic solution. It combines a large logic fabric with on-chip memory and extensive I/O to address designs that require reprogrammability, nonvolatile configuration retention, and industrial-temperature operation.
With 24,576 logic elements, approximately 147,456 bits of embedded memory, 154 user I/Os, and a 208-pin BFQFP package, this device targets portable, consumer, battery-backed and industrial applications where low power, in-system programmability and secure configuration are important.
Key Features
- Logic Capacity – 24,576 logic elements (equivalent cells) and a 1,000,000-gate capacity for implementing complex combinatorial and sequential designs.
- Embedded Memory – Approximately 0.147 Mbits of embedded memory (147,456 bits) for FIFOs, buffers and small data stores.
- I/O and Voltage Support – 154 user I/Os with support for mixed-voltage operation and bank-selectable I/O voltages as provided by the ProASIC3 family.
- Secure In-System Programming – Flash-based reprogrammability with on-chip AES-128 decryption for secure ISP via JTAG and FlashLock features (as implemented in the ProASIC3 family).
- Power and Performance – Low-voltage core operation with supply range of 1.425 V to 1.575 V and instant-on/nonvolatile configuration retention characteristics from the ProASIC3 architecture.
- Package and Mounting – 208-BFQFP package (supplier device package: 208-PQFP, 28×28) designed for surface-mount assembly.
- Industrial Temperature Grade – Rated for operation from –40 °C to 100 °C, suitable for industrial environments.
- RoHS Compliant – Manufactured to comply with RoHS requirements.
Typical Applications
- Portable and Battery-Powered Devices – Low core voltage and instant-on, nonvolatile configuration make the device suitable for portable equipment and battery-backed systems.
- Consumer and High-Volume Electronics – Flash-based reprogrammability and a compact 208-BFQFP package support cost-sensitive, high-volume designs.
- Industrial Control and Automation – Industrial temperature rating and abundant I/Os enable sensor interfacing, control logic and communications in industrial settings.
- Secure In-System Programmable Designs – AES-based ISP and FlashLock support secure updates and field programmability for deployed systems.
Unique Advantages
- Highly Integrated, Single-Chip Solution: Combines logic, embedded memory and I/O in one device to reduce BOM and board complexity.
- Nonvolatile, Instant-On Operation: Flash-based configuration retains the design when powered off, simplifying boot and power-cycle behavior.
- Secure Field Updates: On-chip AES-128 decryption and FlashLock provide mechanisms for secured in-system programming via JTAG.
- Industrial-Grade Robustness: –40 °C to 100 °C operating range and RoHS compliance support use in demanding environments and regulated supply chains.
- Flexible I/O and Packaging: 154 user I/Os and a 208-pin BFQFP surface-mount package provide connectivity and board-level integration options for many form factors.
Why Choose M1A3P1000-2PQG208I?
The M1A3P1000-2PQG208I delivers a balanced mix of programmable logic density, embedded memory, secure in-system programmability and industrial temperature capability in a single, flash-based FPGA. It is well suited to designers who need reprogrammable, nonvolatile logic with flexible I/O and robust thermal margins for portable, consumer, battery-backed and industrial applications.
Backed by Microchip Technology’s ProASIC3 architecture, this device offers a practical combination of integration and security features that simplify system design, enable field updates, and reduce board-level component count.
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