M1A3P1000-2FGG484I

The M1A3P1000-2FGG484I is a ProASIC3 reprogrammable, nonvolatile FPGA optimized for applications that require high I/O density, on-chip embedded memory, and secure in-system programmability. Built on the ProASIC3 family architecture, this device delivers a balance of logic capacity, mixed-voltage I/O flexibility, and low-power single-chip operation suitable for portable, consumer, and industrial designs.

With 24,576 logic elements, approximately 147,456 bits of embedded RAM, and support for secure AES-based in-system programming, this FPGA is suited to designs that need reconfigurable logic, instant-on behavior, and robust supply/temperature operating ranges.

Key Features

• Core Logic 24,576 logic elements (listed as Number Of Logic Elements Cells) and approximately 1,000,000 system gates provide a substantial programmable fabric for glue logic, protocol bridging, and custom datapaths.
• Embedded Memory Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) for FIFOs, buffers, and small-state storage; family datasheet also documents user FlashROM for nonvolatile storage.
• High I/O Density 300 user I/Os enable complex external interfacing and high-pin-count designs while supporting multiple voltage standards across I/O banks as described by the ProASIC3 family.
• Power and Supply Core supply range specified at 1.425 V to 1.575 V; ProASIC3 family features low-power, instant-on flash-based operation suitable for power-sensitive applications.
• Security and In-System Programming Supports secure in-system programming functionality from the ProASIC3 family, including on-chip AES decryption and FlashLock-style protections for design security.
• Package & Mounting 484-ball BGA package (484-FPBGA, 23 × 23) in a surface-mount form factor to support compact PCB layouts and high-density board routing.
• Operating Range & Compliance Industrial operating temperature range of −40 °C to 100 °C and RoHS-compliant construction for deployment in industrial and commercial systems.
• Routing & Clocking ProASIC3 family routing and clock features provide segmented, hierarchical routing and clock conditioning resources (family-level capability referenced in the datasheet).

Typical Applications

• Portable and Battery-Powered Devices Low-power, instant-on flash-based FPGA behavior and mixed-voltage I/O make this device suitable for compact portable systems and battery-backed applications.
• Consumer Electronics High I/O count and programmable logic permit rapid differentiation and hardware acceleration in consumer products requiring flexible interfaces.
• Industrial Control & Automation Industrial temperature rating and robust I/O capability support sensor aggregation, motor-control glue logic, and deterministic interfacing in industrial equipment.
• Secure In-System Programmable Designs On-chip AES-based programming and nonvolatile configuration allow secure field updates and protected IP storage for products that require controlled provisioning.

Unique Advantages

• Reprogrammable, Nonvolatile Architecture: Flash-based configuration retains designs when powered off and enables instant-on behavior without external configuration memory.
• High Logic and I/O Capacity: 24,576 logic elements combined with 300 user I/Os enable complex, multi-interface designs while minimizing external glue logic.
• Secure Field Updates: Family-level AES in-system programming capabilities and FlashLock-style protection secure bitstream delivery and on-board updates.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsher environments and industrial applications.
• Compact High-Density Packaging: 484-ball FPBGA (23 × 23) supports space-constrained designs with high pin counts and reliable surface-mount assembly.
• Controlled Core Voltage: Defined core supply range (1.425 V–1.575 V) simplifies power-supply selection for reliable device operation.

Why Choose M1A3P1000-2FGG484I?

This ProASIC3 FPGA part delivers a strategic combination of reprogrammable nonvolatile logic, significant I/O connectivity, and on-chip embedded memory for engineers building differentiated, secure, and power-aware systems. Its industrial temperature rating and BGA packaging make it suitable for both product development and volume deployment where board space and environmental resilience matter.

The device is appropriate for teams that require a single-chip programmable solution with secure in-field programmability, a high I/O count, and a defined core-voltage profile—supporting faster time-to-market and reduced BOM compared with multi-chip alternatives.

Request a quote or submit a product inquiry to check availability, lead times, and pricing for M1A3P1000-2FGG484I. Our team can provide technical and purchasing support to help integrate this FPGA into your next design.