M1A3P1000-2FGG256

The M1A3P1000-2FGG256 is a ProASIC3 flash-based FPGA from Microchip Technology, offering a nonvolatile, reprogrammable single-chip solution. It combines a high-logic capacity fabric with embedded memory and flexible I/O to address cost-sensitive, space-constrained designs in consumer, portable, and other commercial markets.

Designed for applications that require instant-on behavior, hardware security and low power operation, this device provides a balance of integration and configurability for fast time-to-market and ASIC/ASSP replacement scenarios.

Key Features

• Logic Capacity — 24,576 logic elements (equivalent macrocells) and approximately 1,000,000 system gates for mid-density logic integration.
• Embedded Memory — 147,456 bits of on-chip RAM (approximately 0.147 Mbits) to support data buffering, FIFOs and small working sets.
• I/O and Mixed-Voltage Support — 177 user I/Os with bank-selectable voltages; series supports 1.5V, 1.8V, 2.5V and 3.3V single-ended standards for mixed-voltage designs.
• Reprogrammable Flash Technology — Flash-based CMOS process with instant-on capability and retained configuration when power is removed.
• Security and In-System Programming — On-chip 128-bit AES decryption for JTAG-based in-system programming and FlashLock protection for securing FPGA contents.
• Clocking and Timing — High-performance routing and clock hierarchy with configurable Clock Conditioning Circuit blocks and integrated PLL options (series feature).
• Power and Supply — Core supply range of 1.425 V to 1.575 V, optimized for low-power single-core operation consistent with the ProASIC 3 nano family.
• Package and Temperature — 256-LBGA surface-mount package (256-FPBGA, 17×17) and commercial operating temperature range of 0 °C to 85 °C.
• RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

• Consumer & Portable Electronics — Instant-on, low-power operation and a compact 256-LBGA package suit portable and battery-backed devices requiring flexible logic and I/O.
• ASIC/ASSP Replacement — Reprogrammable flash architecture and mid-range logic density enable iterative development and cost-effective replacements for fixed-function ASICs or ASSPs.
• Secure In-System Updates — On-chip AES decryption and FlashLock support secure configuration updates and protected field upgrades in commercial products.

Unique Advantages

• Nonvolatile, Instant-On Design: Flash-based configuration retains programmed logic when powered off and supports instant-on system behavior.
• Balanced Integration: 24,576 logic elements combined with approximately 0.147 Mbits of embedded RAM reduces external component count for compact designs.
• Flexible Mixed-Voltage I/O: Bank-selectable I/O voltages and a large count of user I/Os (177) simplify interfacing with multiple voltage domains and peripherals.
• Built-in Security and ISP: 128-bit AES in-system decryption and FlashLock provide hardware-level protection for configuration images and field programming.
• Low-Power Core Supply: Operates from a 1.425 V to 1.575 V core supply to support energy-conscious commercial applications.
• Commercial Temperature and RoHS Compliance: Specified 0 °C to 85 °C operation and RoHS compliance for mainstream commercial product deployments.

Why Choose M1A3P1000-2FGG256?

The M1A3P1000-2FGG256 positions itself as a mid-density, flash-configured FPGA that delivers reprogrammable logic, embedded memory and a high I/O count in a compact 256-LBGA package. It is well suited for commercial projects that demand secure in-field programmability, reduced BOM and fast development cycles.

Backed by Microchip’s ProASIC3 family architecture and supporting documentation, this device is appropriate for designers seeking a nonvolatile FPGA platform with integrated security, mixed-voltage interfacing and a focus on low-power operation.

Request a quote or submit an inquiry to obtain pricing, availability and integration support for the M1A3P1000-2FGG256.