M1A3P1000-2FG484

The M1A3P1000-2FG484 is a ProASIC3 field programmable gate array (FPGA) offered by Microchip Technology. It provides flash-based configuration with features described in the ProASIC3 device family documentation, including Flash*Freeze technology.

With 24,576 logic elements, 300 user I/Os and on-chip RAM, this commercial-grade, surface-mount FPGA in a 484-BGA (23 × 23) package is suited for applications that require moderate-density programmable logic, flexible I/O and controlled supply and thermal ranges.

Key Features

• Core Logic — 24,576 logic elements (listed as Number Of Logic Elements Cells: 24576) and approximately 1,000,000 gates to implement complex custom logic functions.
• Embedded Memory — Total on-chip RAM of 147,456 bits (approximately 0.147 Mbits) for buffering, state storage and small data structures.
• I/O Density — 300 user I/Os to support parallel interfaces, control signals and multi-channel I/O requirements.
• Flash-Based Configuration — Part of the ProASIC3 family with Flash*Freeze technology as described in the device family documentation for flash-based non-volatile configuration.
• Power — Single supply voltage range of 1.425 V to 1.575 V for core power management and system integration.
• Package & Mounting — 484-ball FPBGA package (484-BGA, 23 × 23) in a surface-mount form factor suitable for PCB assembly processes.
• Operating Range — Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Communications Equipment — Implement protocol-specific logic, parallel interfaces and custom data path functions using the device’s 300 I/Os and 24,576 logic elements.
• Data Center and Storage Controllers — Use embedded RAM and configurable logic to handle data buffering, control logic and interface bridging in controller and storage subsystems.
• Industrial Control & Automation — Deploy for motor control logic, sensor aggregation and deterministic I/O handling within the device’s commercial temperature range and package constraints.
• Embedded Systems & Prototyping — Rapidly implement and iterate custom digital functions and peripheral glue logic with on-chip flash-based configuration and moderate logic/memory resources.

Unique Advantages

• Flash-based non-volatile configuration: Enables instant-on behavior and field reprogrammability without external configuration memory.
• Significant I/O capacity: 300 user I/Os provide design flexibility for parallel interfaces, multi-channel signals and mixed I/O requirements.
• Balanced logic and memory: 24,576 logic elements paired with approximately 0.147 Mbits of embedded RAM supports medium-complexity designs without external memory for small buffers and state machines.
• Compact, surface-mount package: 484-BGA (23 × 23) package enables high-density PCB layouts while maintaining robust signal routing options.
• Regulatory and assembly readiness: RoHS compliance and standard surface-mount packaging simplify manufacturing and environmental compliance processes.

Why Choose M1A3P1000-2FG484?

The M1A3P1000-2FG484 positions itself as a commercial-grade, flash-configured FPGA offering a pragmatic balance of logic density, I/O capacity and on-chip memory. It is suitable for designers who need a reprogrammable, non-volatile FPGA in a compact BGA package with defined supply and temperature limits.

Its combination of 24,576 logic elements, 300 I/Os, and embedded RAM supports a wide range of mid-density digital designs while RoHS compliance and surface-mount packaging facilitate modern production workflows. Documentation for the ProASIC3 family (including Flash*Freeze technology) provides further technical detail to support design and integration.

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