M1A3P1000-2FG144

The M1A3P1000-2FG144 is a ProASIC3 family flash-based FPGA from Microchip Technology. It combines a low-power flash architecture with on-chip logic and embedded memory to support custom digital logic and I/O tasks in commercial embedded systems.

With 24,576 logic elements, approximately 0.147 Mbits of embedded RAM, and 97 user I/Os in a compact 144-LBGA package, this device is suited to board-level designs that require moderate logic density, deterministic I/O counts, and low-voltage operation.

Key Features

• Core Logic  24,576 logic elements (logic element cells) providing a total gate-equivalent capacity of approximately 1,000,000 gates for implementing custom digital functions.
• Embedded Memory  Total on-chip RAM of 147,456 bits, which is approximately 0.147 Mbits of embedded memory for buffering and small data structures.
• I/O Capacity  97 user I/Os to support a variety of external interfaces and board-level peripherals.
• Low‑Power Flash Architecture  Part of the ProASIC3 family that incorporates flash-based configuration and family-level low-power features noted in the series documentation, including Flash*Freeze technology.
• Power Supply  Operates from a core supply in the range 1.425 V to 1.575 V, enabling designs targeting low-voltage systems.
• Package & Mounting  144-LBGA package; supplier device package listed as 144-FPBGA (13×13). Surface-mount device for standard PCB assembly flows.
• Operating Range  Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• Commercial embedded systems  Implement custom control logic, glue logic, and protocol adaptation where a commercial-grade FPGA solution is required.
• Interface bridging and I/O expansion  Use the 97 I/Os to add or rearrange board-level interfaces without redesigning fixed-function ASICs.
• Low‑power designs  Leverage the ProASIC3 family’s flash-based, low-power characteristics and Flash*Freeze family feature for energy-conscious commercial applications.

Unique Advantages

• High logic density: 24,576 logic elements and a gate-equivalent capacity around 1,000,000 gates enable substantive logic integration at the board level.
• Embedded memory on-chip: Approximately 0.147 Mbits of RAM reduces dependence on external memory for buffering and small-state storage.
• Deterministic I/O count: 97 user I/Os simplify hardware partitioning for multi-interface designs and minimize need for external I/O expanders.
• Compact, surface-mount package: 144-LBGA (144-FPBGA, 13×13) provides a small footprint for space-constrained PCBs while supporting standard SMT assembly.
• Commercial temperature grading: 0 °C to 85 °C supports a wide range of general-purpose commercial deployments.
• Regulatory friendliness: RoHS compliance supports use in products requiring lead-free assembly and environmental compliance.

Why Choose M1A3P1000-2FG144?

The M1A3P1000-2FG144 positions itself as a commercially graded, flash-configuration FPGA that balances logic capacity, embedded memory, and I/O count in a compact LBGA package. Its specification set—24,576 logic elements, roughly 0.147 Mbits of on-chip RAM, and 97 I/Os—makes it a practical choice for engineers designing commercial embedded systems that require flexible, reprogrammable logic and deterministic hardware interfacing.

Engineers and procurement teams looking for a vendor-backed FPGA option with flash-based configuration, low-voltage operation, and RoHS compliance will find this part aligns with designs that prioritize moderate logic density, compact board integration, and commercial-temperature operation.

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