M1A3P1000-1PQG208

The M1A3P1000-1PQG208 is a ProASIC3 family FPGA delivering a high-density, reprogrammable, single-chip solution for embedded logic and control. Built for low-power, secure, instant-on applications, this device combines 24,576 logic elements with on-chip nonvolatile configuration and a broad set of I/O and clocking resources.

Targeted at commercial consumer, portable, and battery-backed systems, the device offers a balance of integration, security and flexible I/O to accelerate time-to-market for control, interface and peripheral-aggregation functions.

Key Features

• Logic Capacity — 24,576 logic elements (logic cells) and approximately 1,000,000 equivalent gates for implementing complex control, glue logic and custom datapaths.
• Embedded Memory — 147,456 bits of total on-chip RAM for FIFOs, buffering and local storage; includes support for true dual-port SRAM organizations from the datasheet series information.
• I/O Flexibility — 154 user I/Os with mixed-voltage operation (1.5V, 1.8V, 2.5V and 3.3V as described in the family datasheet) and bank-selectable I/O voltages for interfacing to varied peripherals and supplies.
• Reprogrammable Flash Technology — Nonvolatile flash configuration enables instant-on behavior and retains programmed design when powered off, simplifying system boot and power cycles.
• Security and In-System Programming (ISP) — Series-level support for on-chip 128-bit AES decryption via JTAG and FlashLock® to secure programmed contents during in-system updates.
• Power — Low-power architecture with a specified core supply range of 1.425 V to 1.575 V, suitable for 1.5V-centric system designs.
• Clocking and Timing — High-performance routing and clock resources with configurable clock conditioning (CCC) blocks and integrated PLL options referenced in the series documentation to support varied clocking schemes.
• Package and Mounting — 208‑BFQFP surface-mount package (supplier device package: 208‑PQFP 28×28) for standard PCB assembly; commercial operating temperature of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• Portable and Battery-Backed Devices — Low-power, instant-on operation and nonvolatile configuration make the device suitable for battery-powered controllers and portable electronics where fast start-up and retained configuration matter.
• Consumer Electronics — Use for interface bridging, custom control logic, and feature offload in consumer products that require a compact, reprogrammable single-chip solution.
• Secure In-System Upgrades — Devices and systems that need secure field updates can leverage the on-chip AES ISP and FlashLock® capabilities described for controlled, encrypted configuration delivery.
• Peripheral Aggregation and Glue Logic — High I/O count and mixed-voltage support enable consolidation of multiple interface functions and board-level glue logic into a single FPGA.

Unique Advantages

• Highly integrated single-chip solution: Combines tens of thousands of logic elements, embedded RAM and nonvolatile configuration to reduce system BOM and board area.
• Nonvolatile instant-on behavior: Flash-based configuration retains programmed design when powered off, simplifying power sequencing and enabling fast startup.
• Secure field programmability: On-chip AES decryption via JTAG and FlashLock® support secure in-system programming workflows.
• Flexible mixed-voltage I/O: Support for multiple I/O voltage levels and bank-selectable I/O voltages allows direct interfacing to a wide range of peripherals without extra level-shifting components.
• Designed for low-power systems: 1.5V core supply range and low-power family architecture help minimize system power consumption in portable and battery-powered applications.
• Production-friendly packaging: 208‑BFQFP surface-mount package fits standard PCB assembly processes while delivering a high pin count.

Why Choose M1A3P1000-1PQG208?

The M1A3P1000-1PQG208 positions itself as a versatile ProASIC3 FPGA that balances high logic capacity, robust on-chip memory, and secure, nonvolatile configuration. Its combination of 24,576 logic elements, 147,456 bits of embedded RAM and 154 user I/Os provides the resources needed for complex embedded designs while keeping system integration streamlined.

This part is well suited for commercial designs in consumer, portable and battery-backed markets where low power, instant-on behavior and secure in-field updates are important. The device’s packaging, voltage and temperature specifications make it straightforward to integrate into standard production environments with RoHS compliance for regulatory alignment.

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