M1A3P1000-1FGG484I

IC FPGA 300 I/O 484FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA

Quantity 1,455 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O300Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of M1A3P1000-1FGG484I – ProASIC3 Field Programmable Gate Array (FPGA) IC, 300 I/O, 484-BGA

The M1A3P1000-1FGG484I is a ProASIC3 nano reprogrammable, nonvolatile FPGA from Microchip Technology. It combines a high logic capacity with on-chip embedded RAM and flash-based nonvolatile storage to support instant-on, secure FPGA designs.

Designed for applications where performance, integration and low power matter, this device offers 24,576 logic elements, 300 user I/Os, and an industrial operating range for use in portable, consumer and industrial systems.

Key Features

  • Logic Capacity — 24,576 logic elements (VersaTiles/LEs) delivering a programmable fabric equivalent to 1,000,000 system gates for complex control and data-path logic.
  • Embedded Memory — 147,456 bits of on-chip RAM and internal FlashROM resources for user nonvolatile storage and SRAM/FIFO requirements.
  • High I/O Count & Mixed-Voltage Support — 300 user I/Os with support for mixed I/O voltages and bank-selectable I/O voltages to interface directly with multiple peripheral voltage domains.
  • Security and In-System Programming — Series-level support for AES-128 ISP and FlashLock designed to protect programmed contents and enable secure in-system updates.
  • Clocking and Timing — Configurable clock conditioning circuitry (CCCs) with integrated PLL options for phase shift, multiply/divide and frequency conditioning suitable for varied clocking needs.
  • Power and Voltage — Core supply operation specified from 1.425 V to 1.575 V and architecture-level low-power characteristics suitable for power-sensitive designs.
  • Package and Mounting — 484-ball FPBGA package (23 × 23) in surface-mount configuration, optimized for dense board layouts.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, supporting robust performance in industrial environments.
  • Standards & I/O Features — Single-ended I/O standards and features from the series including selectable Schmitt trigger inputs, programmable slew rate and drive strength, and JTAG boundary-scan support.

Typical Applications

  • Consumer & Portable Electronics — Implement control logic, user interfaces, and glue logic in compact, low-power portable devices that benefit from instant-on nonvolatile FPGA operation.
  • Battery-Backed Systems — Use on-chip Flash and low-power core operation to maintain configuration and reduce power draw in battery-backed applications.
  • Industrial Control — Leverage the industrial temperature rating and high I/O count for sensor interfacing, I/O aggregation, and real-time control tasks in factory and process automation.
  • Secure In-System Programmable Designs — Deploy devices requiring secure firmware updates and IP protection using the series-level AES ISP and FlashLock features.

Unique Advantages

  • Reprogrammable Nonvolatile Fabric: Flash-based configuration retains designs when powered off and enables instant-on behavior to simplify system boot.
  • High Integration: Large logic element count and substantial on-chip RAM reduce external component count and simplify board-level design.
  • Flexible I/O Interfacing: 300 I/Os with mixed-voltage support and bank selection enable direct connection to diverse peripheral voltages without level shifters.
  • Secure Update Capability: AES-128 in-system programming and FlashLock provide mechanisms for protected updates and IP protection.
  • Industrial Robustness: Surface-mount 484-FPBGA package and −40 °C to 100 °C operating range support deployment in demanding environments.

Why Choose M1A3P1000-1FGG484I?

The M1A3P1000-1FGG484I positions itself as a versatile, secure and low-power FPGA option within the ProASIC3 nano family. Its combination of 24,576 logic elements, substantial on-chip RAM, and 300 user I/Os delivers a balanced platform for designers seeking high integration and reliable operation across industrial and portable applications.

This device is well suited to teams that need nonvolatile, reprogrammable logic with secure in-system update capability, flexible I/O voltage support, and a package footprint optimized for dense PCBs. The industrial temperature rating and surface-mount 484-FPBGA package support long-term deployment in a wide range of systems.

Request a quote or submit an inquiry to check availability and pricing for the M1A3P1000-1FGG484I and to discuss how it can fit into your next design.

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