M1A3P1000-1FGG144M
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 97 147456 144-LBGA |
|---|---|
| Quantity | 1,088 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | MIL-STD-883 | Total RAM Bits | 147456 |
Overview of M1A3P1000-1FGG144M – ProASIC3 Field Programmable Gate Array (FPGA) IC, 97 I/Os, 144-LBGA
The M1A3P1000-1FGG144M is a ProASIC3 family field programmable gate array (FPGA) supplied in a 144-ball LBGA package. It provides a balance of programmable logic capacity, on-chip memory, and I/O resources in a compact surface-mount form factor.
Qualified to MIL-STD-883 and rated as military grade with an operating range of -55 °C to 125 °C, this device is targeted at designs that require robust environmental performance and verified qualification for demanding applications.
Key Features
- Programmable Logic Capacity 24,576 logic elements (cells) enabling up to 1,000,000 gates of user-defined logic.
- Embedded Memory Approximately 0.15 Mbits of on-chip RAM (147,456 bits) for data buffering, state storage, and small look-up tables.
- I/O Density 97 user I/O pins to support a range of peripheral interfaces and board-level interconnections.
- Power Supply Core voltage specified from 1.425 V to 1.575 V for deterministic power planning and regulator selection.
- Package & Mounting 144-LBGA surface-mount package (supplier package: 144-FPBGA, 13 × 13 mm) for compact PCB layouts.
- Qualification & Grade Military grade with MIL-STD-883 qualification for use in qualified defense and high-reliability systems.
- Operating Temperature Guaranteed operation across -55 °C to 125 °C for thermal resilience in harsh environments.
- Environmental Compliance RoHS compliant.
Typical Applications
- Military and Defense Systems Use in designs that require MIL-STD-883 qualification and wide temperature operation.
- Rugged Embedded Systems Integration where a compact, surface-mount FPGA with defined logic capacity and on-chip RAM is required.
- I/O-Constrained Designs Applications that need up to 97 configurable I/Os for interfacing sensors, controllers, or communications peripherals.
Unique Advantages
- Military-Grade Qualification: MIL-STD-883 qualification and a -55 °C to 125 °C rating provide traceable assurance for high-reliability projects.
- Substantial Logic in a Compact Package: 24,576 logic elements and up to 1,000,000 gates in a 144-LBGA allow complex functions without a large footprint.
- Deterministic Power Envelope: A tight core voltage range (1.425 V–1.575 V) simplifies power-supply design and component selection.
- On-Board Memory for Control Tasks: Approximately 0.15 Mbits of embedded RAM for buffering, state machines, and small data structures.
- RoHS Compliant: Meets standard environmental directives for reduced hazardous substances.
Why Choose M1A3P1000-1FGG144M?
The M1A3P1000-1FGG144M positions itself as a reliable, military-qualified FPGA option that combines a sizeable logic element count, embedded memory, and a substantial I/O complement in a compact 144-LBGA surface-mount package. Its MIL-STD-883 qualification and wide operating temperature range make it suitable for applications requiring proven environmental resilience.
Engineers designing high-reliability or defense-focused systems will find this device appropriate when a balance of logic capacity, predictable power requirements, and qualified manufacturing pedigree are priorities. The combination of on-chip resources and ruggedized qualification supports long-term deployment and maintainable system architectures.
Request a quote or submit a procurement inquiry to receive pricing and availability for the M1A3P1000-1FGG144M.

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